SCHEMBL9702836

SCHEMBL9702836

CO[Si](C)(C)CCCNCCNCCC[Si](C)(C)OC

nearest known ligand 0.32

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP2C19 P33261 2/20 0.32
CASP2 P42575 1/20 0.32
ALDH1A1 P00352 1/20 0.32
TSHR P16473 1/20 0.32
MEN1 O00255 1/20 0.32
GLA P06280 1/20 0.32
KMT2A Q03164 1/20 0.32
CYP1A2 P05177 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL558057 0.97 CYP2C19 (0.33) CYP2C19ALDH1A1TSHRMEN1GLA
SCHEMBL18372174 0.91
SCHEMBL9701839 0.91 CA12 (0.46) CYP2C19CASP2ALDH1A1TSHRMEN1
SCHEMBL16976012 0.91
SCHEMBL5505409 0.91 CA12 (0.46) CYP2C19CASP2ALDH1A1TSHRMEN1
SCHEMBL20401716 0.91 LMNA (0.32)
SCHEMBL15489985 0.89 PAOX (0.41) CYP2C19ALDH1A1TSHRMEN1GLA
SCHEMBL18372172 0.89
SCHEMBL5664590 0.89 TSHR (0.44) CYP2C19ALDH1A1TSHRMEN1GLA
SCHEMBL1821225 0.89 LMNA (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4692940-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD Sumitomo Bakelite Co., Ltd. (JP) 2026-02-11 EP disclosed
CN-112689800-B Photosensitive resin composition for forming permanent film, cured film, electronic device, and method for producing same 住友电木株式会社 2024-07-30 CN disclosed
US-11208534-B2 Dynamic polymers based on silyl ether exchange THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2021-12-28 US disclosed
US-5149839-A Improved impregnation, solvent resistance, heat resistance and low water absoprtion properties NITTO BOSEKI CO., LTD. (JP) 1992-09-22 US disclosed
US-5069971-A With epoxy resins, printed circuits, diaminoalklyalkoxysilane NITTO BOSEKI CO., LTD. (JP) 1991-12-03 US disclosed
EP-0368279-A1 Silane coupling agent and glass fiber product for laminates NITTO BOSEKI CO., LTD. (JP) 1990-05-16 EP disclosed