Formaldehyde

Formaldehyde

SCHEMBL9717807

C=O.Cc1ccc2c(c1O)O2

nearest known ligand 0.37

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.37
TRPA1 O75762 1/20 0.33
CYP19A1 P11511 1/20 0.33
ELANE P08246 2/20 0.32
KDM4E B2RXH2 2/20 0.32
HPGD P15428 2/20 0.32
HSD17B10 Q99714 1/20 0.32
CTSG P08311 1/20 0.30
CYP1A2 P05177 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL33479 0.93
Urea SCHEMBL27935569 0.92 ALDH1A1 (0.32) ALDH1A1CYP19A1KDM4EHPGDHSD17B10
Formaldehyde SCHEMBL28064264 0.77 KDM4E (0.43) ALDH1A1KDM4EHPGD
Formaldehyde SCHEMBL9717809 0.74 ESR2 (0.39) ALDH1A1TRPA1KDM4E
SCHEMBL5586915 0.71 ALDH1A1 (0.35) ALDH1A1TRPA1KDM4EHPGD
SCHEMBL510833 0.69
SCHEMBL10807822 0.69
Urea SCHEMBL27402617 0.68 ESR2 (0.35) ALDH1A1KDM4EHSD17B10
SCHEMBL14188444 0.68 ALDH1A1 (0.41) ALDH1A1KDM4EHPGDHSD17B10CYP1A2
SCHEMBL12119917 0.68 NQO2 (0.44) ALDH1A1CYP19A1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112368328-A R-based rubber composition 米其林集团总公司 2021-02-12 CN claimed
CN-103797083-B The BMI of softness, benzimidazole dihydrochloride, epoxy anhydride adduct mixed adhesive 宝特威韩国株式会社 2016-07-27 CN claimed
CN-103797083-A Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive PROTAVIC KOREA CO LTD 2014-05-14 CN claimed
CN-112912257-B Rubber composition based on epoxy resin, amine hardener and imidazole 米其林集团总公司 2023-02-17 CN disclosed
CN-112912257-A Rubber composition based on epoxy resin, amine hardener and imidazole 米其林集团总公司 2021-06-04 CN disclosed
CN-112368328-A R-based rubber composition 米其林集团总公司 2021-02-12 CN disclosed
CN-106653734-B Semiconductor device with electromagnetic interference shielding and method of manufacturing the same 晟碟半导体(上海)有限公司 2020-04-21 CN disclosed
CN-1304505-C Powder coating compositions GEN ELECTRIC (US) 2007-03-14 CN disclosed
CN-1402767-A Powder coating compositions GEN ELECTRIC (US) 2003-03-12 CN disclosed
US-5108824-A Electrical component encapsulants with improved thermal shock resistance THE DOW CHEMICAL COMPANY (US) 1992-04-28 US disclosed