SCHEMBL9718088

SCHEMBL9718088

C=Cc1cccc(N2C(=O)C=CC2=O)c1

nearest known ligand 0.64

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ MGLL Q99685 13/20 0.64
▸ FAAH O00519 7/20 0.64
▸ HSP90AA1 P07900 3/20 0.55
▸ ALDH1A1 P00352 1/20 0.53
▸ PKM P14618 1/20 0.53
▸ HTT P42858 1/20 0.53
▸ ATM Q13315 1/20 0.53
▸ HPN P05981 1/20 0.49
▸ TP53 P04637 1/20 0.42
▸ TDP1 Q9NUW8 1/20 0.42
▸ TLR9 Q9NR96 2/20 0.42
▸ G6PD P11413 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1728478 0.83 MGLL (0.67) MGLLFAAHHSP90AA1ALDH1A1PKM
Styrene SCHEMBL1392538 0.83 MGLL (0.69) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL10894292 0.80 MGLL (0.50) MGLLFAAHHSP90AA1PKMTDP1
SCHEMBL94730 0.80 MGLL (1.00) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1838889 0.80 MGLL (1.00) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL28074222 0.79 MGLL (0.69) MGLLFAAHHSP90AA1ALDH1A1PKM
Styrene SCHEMBL27990543 0.79 MGLL (0.62) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30958998 0.78 MGLL (0.95) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1258213 0.76 MGLL (0.65) MGLLFAAHHSP90AA1ALDH1A1PKM
Styrene SCHEMBL1070534 0.76 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4001149-A Novel fire-retardant polymer THE DOW CHEMICAL COMPANY (US) 1977-01-04 — — US claimed
CN-115826360-B Photosensitive polyimide composition, method for producing pattern, cured product, and electronic component 江苏艾森半导体材料股份有限公司 2023-09-12 — — CN disclosed
CN-110941142-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-05-25 — — CN disclosed
CN-110941142-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2020-03-31 — — CN disclosed
CN-106104381-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2019-12-13 — — CN disclosed
EP-0348906-B1 HEAT-RESISTANT RESIN COMPOSITION SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-10-07 — — EP disclosed
US-4994515-A Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-02-19 — — US disclosed
EP-0348906-A1 Heat-resistant resin composition SHOWA DENKO KABUSHIKI KAISHA (JP) 1990-01-03 — — EP disclosed
EP-0077840-B1 CURABLE RESIN COMPOSITION MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-07-02 — — EP disclosed
US-4506042-A MOLDING, LAMINATION, VARISH MITSUI TOATSU CHEMICALS, INC. (JP) 1985-03-19 — — US disclosed
US-4401777-A Curable resin composition comprising N-(alkenylphenyl)maleimide and epoxy composition MITSUI TOATSU CHEMICALS, INC. (JP) 1983-08-30 — — US disclosed
EP-0077840-A1 Curable resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1983-05-04 — — EP disclosed
US-4111879-A RESIN AND AN N-ARYL-MALEIMIDE IHARA CHEMICAL INDUSTRY CO., LTD. (JP) 1978-09-05 — — US disclosed
US-4001149-A Novel fire-retardant polymer THE DOW CHEMICAL COMPANY (US) 1977-01-04 — — US disclosed
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