SCHEMBL10894292

SCHEMBL10894292

C=Cc1cc(N2C(=O)C=CC2=O)cc(N2C(=O)C=CC2=O)c1

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ MGLL Q99685 14/20 0.50
▸ FAAH O00519 6/20 0.50
▸ NSD2 O96028 1/20 0.48
▸ G6PD P11413 1/20 0.48
▸ KEAP1 Q14145 1/20 0.48
▸ NFE2L2 Q16236 1/20 0.48
▸ HSP90AA1 P07900 4/20 0.48
▸ CCR6 P51684 2/20 0.48
▸ BCHE P06276 1/20 0.39
▸ PKM P14618 1/20 0.39
▸ MAPK1 P28482 1/20 0.39
▸ NPSR1 Q6W5P4 1/20 0.39
▸ TDP1 Q9NUW8 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8641616 0.81 MGLL (0.70) MGLLFAAHNSD2G6PDKEAP1
SCHEMBL9718088 0.80 MGLL (0.64) MGLLFAAHG6PDHSP90AA1PKM
SCHEMBL1258213 0.78 MGLL (0.65) MGLLFAAHHSP90AA1CCR6BCHE
Styrene SCHEMBL1392538 0.74 MGLL (0.69) MGLLFAAHHSP90AA1BCHEPKM
SCHEMBL28074222 0.74 MGLL (0.69) MGLLFAAHHSP90AA1BCHEPKM
SCHEMBL5078820 0.72 MGLL (0.62) MGLLFAAHNSD2G6PDKEAP1
SCHEMBL10885349 0.71 NSD2 (0.60) MGLLFAAHNSD2G6PDKEAP1
SCHEMBL24702071 0.70 MGLL (0.63) MGLLFAAHNSD2G6PDKEAP1
SCHEMBL11752548 0.70 MGLL (0.63) MGLLFAAHNSD2G6PDKEAP1
SCHEMBL5077491 0.70 MGLL (0.60) MGLLFAAHNSD2G6PDKEAP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0077840-B1 CURABLE RESIN COMPOSITION MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-07-02 — — EP disclosed
US-4506042-A MOLDING, LAMINATION, VARISH MITSUI TOATSU CHEMICALS, INC. (JP) 1985-03-19 — — US disclosed
US-4401777-A Curable resin composition comprising N-(alkenylphenyl)maleimide and epoxy composition MITSUI TOATSU CHEMICALS, INC. (JP) 1983-08-30 — — US disclosed
EP-0077840-A1 Curable resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1983-05-04 — — EP disclosed
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