SCHEMBL9723997

SCHEMBL9723997

Nc1cccc(Oc2ccc(C(F)(F)C(F)(c3ccc(Oc4cccc(N)c4)cc3)C(F)(F)F)cc2)c1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 2/20 0.54
ALDH1A1 P00352 5/20 0.47
MAPT P10636 4/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
MITF O75030 1/20 0.47
GAA P10253 1/20 0.47
GFER P55789 1/20 0.47
NLRP1 Q9C000 1/20 0.47
NOD2 Q9HC29 1/20 0.47
POLB P06746 1/20 0.45
HSP90AA1 P07900 1/20 0.45
ATM Q13315 1/20 0.42
LTA4H P09960 1/20 0.41
MAPK1 P28482 2/20 0.40
CYP3A4 P08684 2/20 0.40
TSHR P16473 1/20 0.40
NPC1 O15118 2/20 0.39
RAB9A P51151 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28606659 0.86 MAOB (0.51) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL9578280 0.86 MAOB (0.59) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL7859798 0.84 ALDH1A1 (0.53) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL6751609 0.83 ALDH1A1 (0.49) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL127744 0.83 MAOB (0.59) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29371179 0.83 MAOB (0.59) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29390225 0.83 MAOB (0.59) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL30098473 0.82 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL4703990 0.82 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL7739447 0.82 ALDH1A1 (0.56) MAOBALDH1A1MAPTSMN1; SMN2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112585228-B Polyimide varnish for coating conductor containing aromatic carboxylic acid and method for producing same PI尖端素材株式会社 2022-07-08 CN disclosed
CN-114174422-A Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board DIC株式会社 2022-03-11 CN disclosed
CN-112585228-A Polyimide varnish for coating conductor containing aromatic carboxylic acid and method for producing same PI尖端素材株式会社 2021-03-30 CN disclosed
US-5093453-A Transparent, Low Dielectric ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 1992-03-03 US disclosed