SCHEMBL9732303

SCHEMBL9732303

O=C=CC=CCc1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.56
CA1 P00915 1/20 0.44
CA2 P00918 1/20 0.44
ARG2 P78540 1/20 0.44
TOP1 P11387 1/20 0.41
MAPK1 P28482 1/20 0.34
ADH1B P00325 1/20 0.33
ADH1C P00326 1/20 0.33
ADH1A P07327 1/20 0.33
ADH7 P40394 1/20 0.33
CALM1 P0DP23 1/20 0.33
KCNH2 Q12809 2/20 0.33
IDO1 P14902 2/20 0.32
EPHX2 P34913 1/20 0.32
CES2 O00748 1/20 0.32
CES1 P23141 1/20 0.32
AKR1B1 P15121 1/20 0.32
AGXT P21549 1/20 0.31
TP53 P04637 1/20 0.31
LOXL2 Q9Y4K0 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL628859 0.79 MAOB (0.78) MAOBCA1CA2ARG2TOP1
SCHEMBL462351 0.79 MAOB (0.78) MAOBCA1CA2ARG2TOP1
SCHEMBL6803900 0.78 MAOB (0.54) MAOBCA1CA2ARG2TOP1
SCHEMBL6803903 0.78 MAOB (0.54) MAOBCA1CA2ARG2TOP1
SCHEMBL27558493 0.77 MAOB (0.74) MAOBCA1CA2ARG2TOP1
SCHEMBL30075910 0.77 MAOB (0.74) MAOBCA1CA2ARG2TOP1
SCHEMBL3132480 0.76 MAOB (0.64) MAOBCA1CA2ARG2TOP1
SCHEMBL12809833 0.76 MAOB (0.64) MAOBCA1CA2ARG2TOP1
SCHEMBL145089 0.76 MAOB (0.64) MAOBCA1CA2ARG2TOP1
SCHEMBL261253 0.74 MAOB (0.61) MAOBCA1CA2ARG2TOP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113201149-B Modified lignin compound, high-toughness lignin-based polymer composite material, preparation method and application 南京林业大学 2022-12-02 CN disclosed
US-5112440-A METHOD FOR MAKING METALLIC PATTERNS CIBA-GEIGY CORPORATION (US) 1992-05-12 US disclosed
EP-0425437-A2 Method for making metallic patterns CIBA-GEIGY AG (CH) 1991-05-02 EP disclosed
EP-0294325-A2 Process of making a metallic pattern CIBA-GEIGY AG (CH) 1988-12-07 EP disclosed
EP-0115471-B1 IMAGE-FORMING PROCESS CIBA-GEIGY AG (CH) 1988-02-10 EP disclosed
US-4546067-A Image production utilizing multifunctional light sensitive compounds CIBA GEIGY CORPORATION (US) 1985-10-08 US disclosed
EP-0115471-A2 Image-forming process CIBA-GEIGY AG (CH) 1984-08-08 EP disclosed