Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CDK1 | P06493 | 3/20 | 0.36 |
| ▸ | CCNB1 | P14635 | 3/20 | 0.36 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.35 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.35 |
| ▸ | CCNA2 | P20248 | 2/20 | 0.35 |
| ▸ | CDK2 | P24941 | 2/20 | 0.35 |
| ▸ | CCNA1 | P78396 | 2/20 | 0.35 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.33 |
| ▸ | PIN1 | Q13526 | 1/20 | 0.33 |
| ▸ | F2RL1 | P55085 | 8/20 | 0.32 |
| ▸ | NOS1 | P29475 | 1/20 | 0.32 |
| ▸ | DHFR | P00374 | 1/20 | 0.32 |
| ▸ | FPR2 | P25090 | 1/20 | 0.32 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28569793 | 1.00 | CDK1 (0.36) | CDK1CCNB1CYP1A2CYP3A4CYP2D6 | |
| SCHEMBL28577410 | 0.99 | CYP1A2 (0.35) | CDK1CCNB1CYP1A2CYP3A4CYP2D6 | |
| SCHEMBL28566835 | 0.94 | CYP1A2 (0.36) | CDK1CCNB1CYP1A2CYP3A4CYP2D6 | |
| SCHEMBL28569899 | 0.90 | FPR2 (0.36) | CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9 | |
| SCHEMBL28363270 | 0.85 | CYP1A2 (0.41) | CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9 | |
| SCHEMBL5367788 | 0.84 | TXN (0.34) | CDK1CCNB1CCNA2CDK2CCNA1 | |
| SCHEMBL14880753 | 0.83 | CYP1A2 (0.42) | CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9 | |
| SCHEMBL19642925 | 0.78 | CYP1A2 (0.44) | CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9 | |
| SCHEMBL6901700 | 0.77 | FPR2 (0.32) | FPR2 | |
| SCHEMBL18934211 | 0.76 | CYP1A2 (0.41) | CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101959979-B | Nonaqueous inkjet ink composition | DAINIPPON TORYO KK | 2014-05-07 | — | — | CN | disclosed |
| US-8440745-B2 | Nonaqueous inkjet ink composition | DAI NIPPON TORYO CO., LTD. (JP) | 2013-05-14 | — | — | US | disclosed |
| EP-2284226-A1 | NONAQUEOUS INKJET INK COMPOSITION | Dai Nippon Toryo Co., Ltd. (JP) | 2011-02-16 | — | — | EP | disclosed |
| US-20110009537-A1 | Nonaqueous Inkjet Ink Composition | DAI NIPPON TORYO CO., LTD. (JP) | 2011-01-13 | — | — | US | disclosed |
| EP-1403291-B1 | PROCESS FOR PRODUCING POLYMER HAVING CROSSLINKABLE SILYL GROUP AND CURABLE COMPOSITION | KANEKA CORP (JP) | 2007-08-29 | — | — | EP | disclosed |
| EP-0851726-B1 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same | AJINOMOTO KK (JP) | 2006-05-03 | — | — | EP | disclosed |
| US-7037586-B2 | Film for circuit board | AJINOMOTO CO., INC. (JP) | 2006-05-02 | — | — | US | disclosed |
| US-20050178501-A1 | Process for producing a multi-layer printer wiring board | AJINOMOTO CO., INC. (JP) | 2005-08-18 | — | — | US | disclosed |
| US-6881293-B2 | Process for producing a multi-layer printer wiring board | AJINOMOTO CO., INC. (JP) | 2005-04-19 | — | — | US | disclosed |
| EP-1453364-A1 | FILM FOR CIRCUIT BOARD | Ajinomoto Co., Inc. (JP) | 2004-09-01 | — | — | EP | disclosed |
| US-20040142155-A1 | Film for circuit board | AJINOMOTO CO., INC (JP) | 2004-07-22 | — | — | US | disclosed |
| US-20040099367-A1 | Adhesive film and method for manufacturing multilayer printed wiring board comprising the same | AJINOMOTO CO., INC. (JP) | 2004-05-27 | — | — | US | disclosed |
| EP-1307077-A1 | ADHESIVE FILM AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD COMPRISING THE SAME | Ajinomoto Co., Inc. (JP) | 2003-05-02 | — | — | EP | disclosed |
| US-20020076539-A1 | Process for producing a multi-layer printer wiring board | NAKAMURA SHIGEO (JP) | 2002-06-20 | — | — | US | disclosed |
| US-6376053-B1 | BLEND OF EPOXY RESIN AND CURING AGENTS | AJINOMOTO CO., INC. (JP) | 2002-04-23 | — | — | US | disclosed |
| US-6370350-B2 | Method for developing electrostatic latent image and developing roller and developing device therefor | RICOH COMPANY LIMITED (JP) | 2002-04-09 | — | — | US | disclosed |
| US-20010014233-A1 | Method for developing electrostatic latent image and developing roller and developing device therefor | RICOH COMPANY LIMITED (JP) | 2001-08-16 | — | — | US | disclosed |
| EP-0851726-A2 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same | Ajinomoto Co., Inc. (JP) | 1998-07-01 | — | — | EP | disclosed |