SCHEMBL974360

SCHEMBL974360

[CH]1[CH][CH]CC[CH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7694325 0.78
SCHEMBL23908715 0.78
SCHEMBL23908691 0.72
SCHEMBL321676 0.69
SCHEMBL7695861 0.67
SCHEMBL975167 0.67
SCHEMBL102954 0.63
SCHEMBL2992458 0.62
SCHEMBL130748 0.62
SCHEMBL7689031 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
EP-3896114-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed
US-10914987-B2 Complex and optical element KYOTO UNIVERSITY (JP) 2021-02-09 US disclosed
US-20200241336-A1 COMPLEX AND OPTICAL ELEMENT KYOTO UNIVERSITY (JP) 2020-07-30 US disclosed
US-10011773-B2 Liquid crystal display device DIC CORPORATION (JP) 2018-07-03 US disclosed
US-9809752-B2 Liquid crystal display device DIC CORPORATION (JP) 2017-11-07 US disclosed
US-9597306-B1 Fumarate compounds, pharmaceutical compositions thereof, and methods of use Nguyen, Mark Quang (US) 2017-03-21 US disclosed
US-20170056358-A1 FUMARATE COMPOUNDS, PHARMACEUTICAL COMPOSITIONS THEREOF, AND METHODS OF USE Nguyen, Mark Quang (US) 2017-03-02 US disclosed
US-20150166893-A1 LIQUID CRYSTAL-POLYMER COMPOSITE MATERIAL DIC Corporation (Tokyo) (JP) 2015-06-18 US disclosed
US-8475937-B2 Silicone composition and organic light-emitting diode DOW CORNING CORPORATION (US) 2013-07-02 US disclosed
EP-2262861-B1 SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE DOW CORNING (US) 2012-09-19 EP disclosed
US-20110017986-A1 Silicone Composition and Organic Light-Emitting Diode DOW CORNING CORPORATION 2011-01-27 US disclosed
EP-2262861-A1 SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE Dow Corning Corporation (US) 2010-12-22 EP disclosed
WO-2009120434-A1 SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE DOW CORNING CORPORATION (US) 2009-10-01 WO disclosed
US-20090137774-A1 ADAMANTANE DERIVATIVE, RESIN COMPOSITION CONTAINING SAME, AND OPTOELECTRONIC COMPONENT USING SAME IDEMITSU KOSAN CO., LTD. (JP) 2009-05-28 US disclosed
EP-1930327-A1 ADAMANTANE DERIVATIVE, RESIN COMPOSITION CONTAINING SAME, AND OPTOELECTRONIC COMPONENT USING SAME IDEMITSU KOSAN CO., LTD. (JP) 2008-06-11 EP disclosed
US-6335143-B1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2002-01-01 US disclosed
EP-0887706-A1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) 1998-12-30 EP disclosed