SCHEMBL974987

SCHEMBL974987

[CH]1[CH]C[CH][CH]C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6918 0.91
SCHEMBL7697307 0.82
SCHEMBL23908695 0.74
SCHEMBL3788025 0.72
SCHEMBL2992458 0.72
SCHEMBL395630 0.72
SCHEMBL4130638 0.68
SCHEMBL7695201 0.68
SCHEMBL7689963 0.67
SCHEMBL25653 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4275184-A HYDROSILATION OF POLYDIMETHYL SILOXANE RHONE-POULENC INDUSTRIES (FR) 1981-06-23 US claimed
US-20240199847-A1 RESIN COMPOSITION AND ELECTRONIC DEVICE KONICA MINOLTA INC (JP) 2024-06-20 US disclosed
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 CN disclosed
US-11920019-B2 Resin composition and electronic device Konica Minolta, Inc. (JP) 2024-03-05 US disclosed
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
WO-2023056263-A1 CADAVERINE-BASED POLYIMIDES ZYMERGEN INC. (US) 2023-04-06 WO disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
CN-112805337-B Resin composition and electronic device 柯尼卡美能达株式会社 2022-10-28 CN disclosed
US-11261303-B2 Polyimide resin film and method for producing polyimide resin film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-03-01 US disclosed
US-20210347964-A1 RESIN COMPOSITION AND ELECTRONIC DEVICE Konica Minolta, Inc. (JP) 2021-11-11 US disclosed
US-8357322-B2 Process and apparatus for production of colorless transparent resin film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2013-01-22 US disclosed
EP-2262861-B1 SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE DOW CORNING (US) 2012-09-19 EP disclosed
EP-2147766-B1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM MITSUBISHI GAS CHEMICAL CO (JP) 2012-08-01 EP disclosed
US-20110017986-A1 Silicone Composition and Organic Light-Emitting Diode DOW CORNING CORPORATION 2011-01-27 US disclosed
EP-2262861-A1 SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE Dow Corning Corporation (US) 2010-12-22 EP disclosed
US-20100187719-A1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-07-29 US disclosed
EP-2147766-A1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM Mitsubishi Gas Chemical Company, Inc. (JP) 2010-01-27 EP disclosed
WO-2009120434-A1 SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE DOW CORNING CORPORATION (US) 2009-10-01 WO disclosed
US-3953338-A Foam well cleanout using oligomeric sulfonic acids CHEVRON RESEARCH COMPANY (US) 1976-04-27 US disclosed
US-3951823-A Foam well cleanout using oligomeric sulfonates CHEVRON RESEARCH COMPANY (US) 1976-04-20 US disclosed