Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 3/20 | 0.68 |
| ▸ | NPC1 | O15118 | 2/20 | 0.68 |
| ▸ | PTK2B | Q14289 | 2/20 | 0.68 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.66 |
| ▸ | RAB9A | P51151 | 1/20 | 0.66 |
| ▸ | ALPG | P10696 | 1/20 | 0.64 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.50 |
| ▸ | GLA | P06280 | 1/20 | 0.50 |
| ▸ | ESR1 | P03372 | 1/20 | 0.50 |
| ▸ | YWHAB | P31946 | 1/20 | 0.50 |
| ▸ | PDK1 | Q15118 | 1/20 | 0.50 |
| ▸ | HCRTR1 | O43613 | 2/20 | 0.49 |
| ▸ | HTT | P42858 | 1/20 | 0.47 |
| ▸ | SFN | P31947 | 1/20 | 0.47 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.46 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.46 |
| ▸ | GAA | P10253 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18486468 | 0.89 | ALDH1A1 (0.55) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL11647770 | 0.87 | ALDH1A1 (0.54) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL10040047 | 0.85 | POLB (0.74) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL2614391 | 0.84 | PTK2B (0.72) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL8527132 | 0.84 | NPC1 (0.49) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL11779185 | 0.84 | POLB (0.77) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL10039996 | 0.82 | PTK2B (0.89) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL8583782 | 0.82 | ALDH1A1 (0.54) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL3247277 | 0.81 | PTK2B (0.68) | POLBNPC1PTK2BALDH1A1RAB9A | |
| SCHEMBL2614392 | 0.81 | POLB (1.00) | POLBNPC1PTK2BALDH1A1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118450886-A | Liquid compositions with enhanced antimicrobial activity | 联合利华知识产权控股有限公司 | 2024-08-06 | — | — | CN | claimed |
| CN-113334866-B | Adhesive layer, optical film with adhesive layer, optical laminate, and image display device | 日东电工株式会社 | 2023-04-07 | — | — | CN | disclosed |
| US-20210363391-A1 | PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL FILM HAVING PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL LAMINATE, AND IMAGE DISPLAY DEVICE | NITTO DENKO CORPORATION (JP) | 2021-11-25 | — | — | US | disclosed |
| CN-113334866-A | Adhesive layer, optical film with adhesive layer, optical laminate, and image display device | 日东电工株式会社 | 2021-09-03 | — | — | CN | disclosed |
| US-10253220-B2 | Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, pressure-sensitive adhesive layer-attached substrate film, laminate, and image display device | NITTO DENKO CORPORATION (JP) | 2019-04-09 | — | — | US | disclosed |
| US-20160326402-A1 | ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITION, ACRYLIC PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE LAYER-ATTACHED SUBSTRATE FILM, LAMINATE, AND IMAGE DISPLAY DEVICE | NITTO DENKO CORPORATION (JP) | 2016-11-10 | — | — | US | disclosed |
| EP-2687573-B1 | POLYESTER RESIN COMPOSITION FOR ELECTRICAL / ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT AND PRODUCTION METHOD THEREFOR | TOYO BOSEKI (JP) | 2016-05-11 | — | — | EP | disclosed |
| US-9080091-B2 | Polyester resin composition for electrical/electronic part-sealing material, sealed product, and production method thereof | TOYOBO CO., LTD. (JP) | 2015-07-14 | — | — | US | disclosed |
| EP-2687573-A1 | POLYESTER RESIN COMPOSITION FOR ELECTRICAL / ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT AND PRODUCTION METHOD THEREFOR | Toyobo Co., Ltd. (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-20130338318-A1 | POLYESTER RESIN COMPOSITION FOR ELECTRICAL/ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT, AND PRODUCTION METHOD THEREOF | TOYOBO CO., LTD. (JP) | 2013-12-19 | — | — | US | disclosed |
| EP-0439470-A1 | PROCESS FOR INCREASING THE MOLECULAR WEIGHT OF A POLYAMIDE. | DU PONT (US) | 1991-08-07 | — | — | EP | disclosed |