SCHEMBL978494

SCHEMBL978494

CCO[SiH2]C(C)(C)CCNCCC(C)(C)[SiH2]OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25339374 0.79
SCHEMBL108272 0.77
SCHEMBL975255 0.76
SCHEMBL3698203 0.74
SCHEMBL109969 0.74
SCHEMBL6522908 0.73 MEN1 (0.33)
SCHEMBL6892063 0.73 SMPD1 (0.38)
SCHEMBL27132206 0.72
SCHEMBL706504 0.66
SCHEMBL7157777 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4370568-B1 TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
EP-4370570-B1 TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION IN HOT FILLING APPLICATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
EP-4370571-B1 POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
EP-4370569-B1 TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION CONTAINING METHOXYSILANE FUNCTIONALIZED ISOCYANATE COMPOUND FOR FILM LAMINATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
US-20250002767-A1 Two-Component Polyurethane Adhesive Composition for Film Lamination in Hot Filling Application HENKEL AG & CO. KGAA (DE) 2025-01-02 US claimed
US-20240336818-A1 Two-Component Polyurethane Adhesive Composition for Film Lamination HENKEL AG & CO KGAA (DE) 2024-10-10 US claimed
US-20240316900-A1 Two-Component Polyurethane Adhesive Composition Containing Methoxysilane Functionalized Isocyanate Compound for Film Lamination HENKEL AG & CO. KGAA (DE) 2024-09-26 US claimed
US-20240301259-A1 Polyurethane Adhesive Composition for Film Lamination HENKEL AG & CO. KGAA (DE) 2024-09-12 US claimed
CN-117715951-A Two-component polyurethane adhesive composition for film lamination in hot fill applications 汉高股份有限及两合公司 2024-03-15 CN claimed
CN-117651727-A Two-component polyurethane adhesive composition for film lamination 汉高股份有限及两合公司 2024-03-05 CN claimed
CN-117616063-A Polyurethane adhesive composition for film lamination 汉高股份有限及两合公司 2024-02-27 CN claimed
CN-117616062-A Two-component polyurethane adhesive composition for film lamination containing methoxy silane functional isocyanate compound 汉高股份有限及两合公司 2024-02-27 CN claimed
US-20120296024-A1 ORGANOSILICON COMPOUND AND ITS PRODUCTION METHOD, COMPOUNDING AGENT FOR RUBBER, RUBBER COMPOSITION, AND TIRE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-11-22 US claimed
EP-2524923-A1 Organosilicon compound and its production method, compounding agent for rubber, rubber composition, and tire Shin-Etsu Chemical Co., Ltd. (JP) 2012-11-21 EP claimed
US-8314264-B2 Photopolymerizable functional radical-containing organosilicon compound and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-11-20 US claimed
CN-118226707-A Photosensitive resin composition, cured film pattern, and method for producing same 奇美实业股份有限公司 2024-06-21 CN disclosed
EP-3543246-B1 COMPOSITION CONTAINING ORGANIC SILICON COMPOUND AND PAINT AND ADHESIVE CONTAINING SAID COMPOSITION SHINETSU CHEMICAL CO (JP) 2024-05-15 EP disclosed
US-20100210862-A1 Photopolymerizable functional radical-containing organosilicon compound and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-19 US disclosed
US-20040028978-A1 Proton conducting membrane, method for producing the same, and fuel cell using the same NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2004-02-12 US disclosed
EP-1334993-A2 Proton conducting membrane, method for producing the same, and fuel cell using the same National Institute of Advanced Industrial Science and Technology (JP) 2003-08-13 EP disclosed