SCHEMBL9825491

SCHEMBL9825491

CC(C)OC(=N)N(C(C)C)C(C)C

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33
CA12 O43570 2/20 0.32
CA1 P00915 2/20 0.32
CA2 P00918 2/20 0.32
CA9 Q16790 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9473923 0.75
SCHEMBL21811860 0.74
SCHEMBL9393135 0.69 ALDH1A1 (0.32)
SCHEMBL2895286 0.69
SCHEMBL12988855 0.67 TSHR (0.46) TSHRCA12CA1CA2CA9
SCHEMBL11102471 0.65 ALDH1A1 (0.32)
SCHEMBL6031323 0.65 TSHR (0.42) TSHRCA12CA1CA2CA9
SCHEMBL24804487 0.63
SCHEMBL14999389 0.63 ALDH1A1 (0.31)
Phosphine SCHEMBL28910692 0.63 ALDH1A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112689800-B Photosensitive resin composition for forming permanent film, cured film, electronic device, and method for producing same 住友电木株式会社 2024-07-30 CN disclosed
CN-116848467-A Photosensitive resin composition, cured film, and semiconductor device 住友电木株式会社 2023-10-03 CN disclosed
CN-112763286-A Method for preparing sample for analysis, method for analysis, and kit for preparing sample for analysis 株式会社岛津制作所 2021-05-07 CN disclosed
CN-110914756-B Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2021-05-04 CN disclosed
CN-112689800-A Photosensitive resin composition for forming permanent film, cured film, electronic device, method for producing cured film, and method for producing electronic device 住友电木株式会社 2021-04-20 CN disclosed
CN-110809737-B Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-11-17 CN disclosed
CN-110914756-A Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-03-24 CN disclosed
CN-110809737-A Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-02-18 CN disclosed
EP-0249236-B1 N-1H-TETRAZOL-5-YL-(5-RING)-CARBOXAMIDE-DERIVATIVES, A PROCESS FOR THEIR MANUFACTURE, AND THE USE THEREOF WARNER-LAMBERT COMPANY (US) 1991-04-24 EP disclosed
US-4824958-A Process for the preparation of n-1H-tetrazol-5-yl-2-pyrrole carboxamides WARNER-LAMBERT COMPANY (US) 1989-04-25 US disclosed
US-4748183-A N-1H-tetrazol-5-yl-2-thiophene carboxamides, N-1H-tetrazol-5-yl-2-pyrrole carboxamides, N-1H-tetrazol-5-yl-2-furan carboxamides, and anti-allergic and anti-inflammatory use thereof WARNER-LAMBERT COMPANY (US) 1988-05-31 US disclosed
EP-0249236-A1 N-1H-Tetrazol-5-yl-(5-Ring)-carboxamide-derivatives, a process for their manufacture, and the use thereof WARNER-LAMBERT COMPANY (US) 1987-12-16 EP disclosed