⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9825491 | 0.74 | TSHR (0.33) | — | |
| SCHEMBL19836482 | 0.74 | — | — | |
| SCHEMBL11740352 | 0.72 | — | — | |
| SCHEMBL9393135 | 0.70 | ALDH1A1 (0.32) | — | |
| SCHEMBL11102471 | 0.67 | ALDH1A1 (0.32) | — | |
| SCHEMBL9473923 | 0.67 | — | — | |
| SCHEMBL14999389 | 0.65 | ALDH1A1 (0.31) | — | |
| Phosphine SCHEMBL28910692 | 0.65 | ALDH1A1 (0.31) | — | |
| SCHEMBL4198326 | 0.65 | — | — | |
| SCHEMBL304773 | 0.65 | CA14 (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116848467-A | Photosensitive resin composition, cured film, and semiconductor device | 住友电木株式会社 | 2023-10-03 | — | — | CN | disclosed |
| CN-112763286-A | Method for preparing sample for analysis, method for analysis, and kit for preparing sample for analysis | 株式会社岛津制作所 | 2021-05-07 | — | — | CN | disclosed |
| CN-110914756-B | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112689800-A | Photosensitive resin composition for forming permanent film, cured film, electronic device, method for producing cured film, and method for producing electronic device | 住友电木株式会社 | 2021-04-20 | — | — | CN | disclosed |
| CN-110809737-B | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2020-11-17 | — | — | CN | disclosed |
| CN-110914756-A | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2020-03-24 | — | — | CN | disclosed |
| WO-2020054644-A1 | PERMANENT FILM-FORMING PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, CURED FILM PRODUCTION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | 住友ベークライト株式会社 | 2020-03-19 | — | — | WO | disclosed |
| CN-110809737-A | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2020-02-18 | — | — | CN | disclosed |