SCHEMBL986161

SCHEMBL986161

CCCOC(=O)OOOC(C)(C)C

nearest known ligand 0.34

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 1/20 0.34
ALDH1A1 P00352 4/20 0.33
LMNA P02545 1/20 0.32
ESR1 P03372 1/20 0.32
CHRM1 P11229 1/20 0.32
TSHR P16473 1/20 0.32
SLC6A2 P23975 1/20 0.32
KDR P35968 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
RAB9A P51151 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28856839 0.89 ALDH1A1 (0.45) HCAR2ALDH1A1LMNAESR1TSHR
SCHEMBL8504224 0.88 HCAR2 (0.41) HCAR2ALDH1A1LMNAESR1CHRM1
SCHEMBL1630028 0.87 NAAA (0.44) HCAR2ALDH1A1LMNATSHR
SCHEMBL28506895 0.85 NAAA (0.47) HCAR2ALDH1A1LMNATSHR
SCHEMBL11710524 0.85 NAAA (0.47) HCAR2ALDH1A1LMNATSHR
SCHEMBL1421042 0.85 NAAA (0.47) HCAR2ALDH1A1LMNATSHR
SCHEMBL8416800 0.85 NAAA (0.47) HCAR2ALDH1A1LMNATSHR
SCHEMBL30457292 0.85 HCAR2 (0.32) HCAR2ALDH1A1LMNAESR1CHRM1
SCHEMBL7619570 0.84 ALDH1A1 (0.33) ALDH1A1TSHR
SCHEMBL20211357 0.84 NAAA (0.35) HCAR2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2185549-A None JP disclosed
WO-2025075116-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075120-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075123-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075152-A1 GRANULAR BODY, METHOD FOR PRODUCING SAME, AND THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075124-A1 MOLDED FILM OR MOLDED SHEET 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075122-A1 CROSSLINKED RESIN PARTICLES AND THERMOPLASTIC RESIN MODIFIER 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075121-A1 CROSS-LINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075118-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075125-A1 BLOW-MOLDED ARTICLE AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
US-20120220712-A1 PROCESS FOR PRODUCING HYDROLYZABLE SILYL GROUP-CONTAINING FLUOROPOLYMER, AND COMPOSITION CONTAINING HYDROLYZABLE SILYL GROUP-CONTAINING FLUOROPOLYMER ASAHI GLASS COMPANY, LIMITED (JP) 2012-08-30 US disclosed
CN-102569876-A Lithium secondary battery HITACHI LTD 2012-07-11 CN disclosed
CN-102544583-A Lithium secondary battery HITACHI LTD 2012-07-04 CN disclosed
EP-2275504-A1 COATING AGENT COMPOSITION Asahi Glass Company, Limited (JP) 2011-01-19 EP disclosed
US-20100331482-A1 COMPOSITION FOR COATING AGENT ASAHI GLASS COMPANY LIMITED (JP) 2010-12-30 US disclosed
US-20050277061-A1 Polymeric material for laser processing and a laminated body for laser processing thereof, flexographic printing plate and the method of producing the same, and a seal material JSR CORPORATION (JP) 2005-12-15 US disclosed
US-5179148-A Silicone rubber composition and method for the preparation thereof SHIN-ETSU CHEMICAL COMPANY LIMITED (JP) 1993-01-12 US disclosed
JP-H02185549-A PREPARATION OF SILANE-CROSSLINKED POLYOLEFIN SHOWA ELECTRIC WIRE & CABLE CO LTD 1990-07-19 JP disclosed
EP-0304056-A1 Use of a perfluoroalkylvinyl polymer DAIKIN INDUSTRIES, LIMITED (JP) 1989-02-22 EP disclosed
US-4058497-A ACRYLIC COPOLYMER OR ALKYD RESIN, ALUMINUM ALKOXIDE COMPLEX, KETO-ENOL TAUTOMER MITSUBISHI GAS CHEMICAL COMPANY, INC. (JA) 1977-11-15 US disclosed