SCHEMBL986829

SCHEMBL986829

[BaH2].[O-2].[O-2].[SrH2].[Zr+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6288944 0.87
SCHEMBL988455 0.87
SCHEMBL7032532 0.75
SCHEMBL8428836 0.75
SCHEMBL5947139 0.75
SCHEMBL5357990 0.75
SCHEMBL472218 0.75
SCHEMBL3938862 0.75
SCHEMBL9590939 0.75
SCHEMBL5315655 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 244 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12063793-B2 Chalcogen compound and semiconductor device including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-08-13 US claimed
EP-3996159-B1 CHALCOGEN COMPOUND AND SEMICONDUCTOR DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO LTD (KR) 2023-11-15 EP claimed
US-20220149114-A1 CHALCOGEN COMPOUND AND SEMICONDUCTOR DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2022-05-12 US claimed
EP-3996159-A1 CHALCOGEN COMPOUND AND SEMICONDUCTOR DEVICE INCLUDING THE SAME Samsung Electronics Co., Ltd. (KR) 2022-05-11 EP claimed
US-20220140003-A1 SEMICONDUCTOR DEVICE INCLUDING CHALCOGEN COMPOUND AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2022-05-05 US claimed
US-12543512-B2 Semiconductor device and semiconductor apparatus including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-02-03 US disclosed
US-12446233-B2 Variable resistance memory device SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-10-14 US disclosed
CN-111415956-B Variable resistance memory device and method of manufacturing the same 三星电子株式会社 2025-01-10 CN disclosed
US-20240414926-A1 SEMICONDUCTOR DEVICE INCLUDING CHALCOGEN COMPOUND AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-12-12 US disclosed
US-12101942-B2 Semiconductor device including chalcogen compound and semiconductor apparatus including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-09-24 US disclosed
US-20240284665-A1 SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-08-22 US disclosed
US-12063793-B2 Chalcogen compound and semiconductor device including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-08-13 US disclosed
US-20120187360-A1 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME SAMSUNG ELECTRONICS CO., LTD (KR) 2012-07-26 US disclosed
US-20110156119-A1 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FORMING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-06-30 US disclosed
US-20110017971-A1 INTEGRATED CIRCUIT DEVICES INCLUDING LOW-RESISTIVITY CONDUCTIVE PATTERNS IN RECESSED REGIONS SAMSUNG ELECTRONICS CO., LTD. 2011-01-27 US disclosed
US-20100240189-A1 Methods of Fabricating Semiconductor Devices SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-09-23 US disclosed
US-20090275169-A1 SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-11-05 US disclosed
EP-0841676-B1 Cathode for electron tube and method for manufacturing the same MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2003-03-05 EP disclosed
US-5925976-A Cathode for electron tube having specific emissive material MATSUSHITA ELECTRONICS CORPORATION (JP) 1999-07-20 US disclosed
EP-0841676-A1 Cathode for electron tube and method for manufacturing the same MATSUSHITA ELECTRONICS CORPORATION (JP) 1998-05-13 EP disclosed