SCHEMBL9869409

SCHEMBL9869409

CC1(C)CC(C(=O)C2CCCCC2)CC(C)(C)N1

nearest known ligand 0.41

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.41
CES2 O00748 1/20 0.39
CES1 P23141 1/20 0.39
LMNA P02545 1/20 0.37
RECQL P46063 2/20 0.35
HDAC8 Q9BY41 1/20 0.34
HDAC6 Q9UBN7 1/20 0.34
TSHR P16473 2/20 0.33
ALDH1A1 P00352 1/20 0.33
POLB P06746 2/20 0.33
HSD11B1 P28845 2/20 0.32
CHRNB2 P17787 2/20 0.31
CHRNB4 P30926 2/20 0.31
CHRNA3 P32297 2/20 0.31
CHRNA4 P43681 2/20 0.31
CHRNA7 P36544 1/20 0.31
APLNR P35414 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11497231 0.87 GAA (0.39) GAARECQLALDH1A1POLBAPLNR
SCHEMBL9813699 0.76 APLNR (0.41) GAACES2CES1LMNARECQL
SCHEMBL29264800 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6
SCHEMBL31486636 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6
SCHEMBL993393 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6
SCHEMBL6937404 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6
SCHEMBL29264798 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6
SCHEMBL346017 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6
SCHEMBL29264799 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6
SCHEMBL9861947 0.75 CES2 (0.65) CES2CES1RECQLHDAC8HDAC6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5013774-A Imidized acrylics, tetramethylpiperidine stabilizer, weatherproofing MITSUBISHI RAYON COMPANY, LTD. (JP) 1991-05-07 US disclosed
EP-0332136-A2 Thermoplastic methacrylimide group-containing resin composition MITSUBISHI RAYON CO., LTD. (JP) 1989-09-13 EP disclosed