SCHEMBL987422

SCHEMBL987422

[CH2]CC(=O)OC1CCC(OC)CC1

nearest known ligand 0.38

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.38
HTT P42858 2/20 0.36
CYP19A1 P11511 6/20 0.36
APOBEC3A P31941 1/20 0.35
APOBEC3G Q9HC16 1/20 0.35
CYP2C19 P33261 1/20 0.34
SMN1; SMN2 Q16637 2/20 0.34
KDM4E B2RXH2 1/20 0.34
RAB9A P51151 1/20 0.33
EPHX2 P34913 1/20 0.33
EPHX1 P07099 1/20 0.32
GAA P10253 1/20 0.31
MAPT P10636 1/20 0.31
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3367960 0.89
SCHEMBL10175028 0.81 NAAA (0.43) NAAAHTTCYP19A1APOBEC3AAPOBEC3G
SCHEMBL7692285 0.80
SCHEMBL988074 0.80 NAAA (0.50) NAAAHTTCYP19A1APOBEC3AAPOBEC3G
SCHEMBL3363236 0.79 APOBEC3A (0.56) NAAAHTTCYP19A1APOBEC3AAPOBEC3G
SCHEMBL7687118 0.78 CYP2C19 (0.53) NAAAHTTCYP19A1CYP2C19SMN1; SMN2
SCHEMBL7692369 0.78 CYP2C19 (0.53) NAAAHTTCYP19A1CYP2C19SMN1; SMN2
SCHEMBL158117 0.78 CYP2C19 (0.53) NAAAHTTCYP19A1CYP2C19SMN1; SMN2
SCHEMBL2005308 0.76 ALDH1A1 (0.51) SMN1; SMN2RAB9AMAPTALDH1A1
SCHEMBL5697658 0.74 NAAA (0.49) NAAAHTTCYP19A1APOBEC3AAPOBEC3G

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11822243-B2 Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor TORAY INDUSTRIES, INC. (JP) 2023-11-21 US disclosed
US-11681222-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2023-06-20 US disclosed
WO-2023095785-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED ARTICLE, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CURED ARTICLE 東レ株式会社 2023-06-01 WO disclosed
US-20230098085-A1 ORGANIC EL DISPLAY DEVICE, PRODUCTION METHOD FOR CURED PRODUCT, AND PRODUCTION METHOD FOR ORGANIC EL DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2023-03-30 US disclosed
US-20220137508-A9 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2022-05-05 US disclosed
US-20210278764-A1 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2021-09-09 US disclosed
US-11036133-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2021-06-15 US disclosed
US-10983436-B2 Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor TORAY INDUSTRIES, INC. (JP) 2021-04-20 US disclosed
US-20210011381-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME TORAY INDUSTRIES, INC. (JP) 2021-01-14 US disclosed
US-10877607-B2 Laminated base material, cover glass, touch panel, and method for manufacturing laminated base material TORAY INDUSTRIES, INC. (JP) 2020-12-29 US disclosed
US-20020009668-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
US-20020009667-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
EP-1164434-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
EP-1162506-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-12 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed
US-6180316-B1 SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS JSR CORPORATION (JP) 2001-01-30 US disclosed
EP-1048983-A1 Radiation sensitive resin composition JSR Corporation (JP) 2000-11-02 EP disclosed
EP-0930541-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-07-21 EP disclosed