Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 2/20 | 0.46 |
| ▸ | FOLH1 | Q04609 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.41 |
| ▸ | SLC37A4 | O43826 | 1/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.39 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.39 |
| ▸ | CLCN2 | P51788 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.39 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | RECQL | P46063 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6004163 | 0.96 | POLB (0.47) | POLBFOLH1ALDH1A1ALOX15SLC37A4 | |
| SCHEMBL3821055 | 0.87 | POLB (0.45) | POLBFOLH1ALDH1A1ALOX15SLC37A4 | |
| SCHEMBL8977519 | 0.86 | FOLH1 (0.48) | POLBFOLH1ALDH1A1ALOX15SLC37A4 | |
| SCHEMBL5695797 | 0.86 | POLB (0.44) | POLBFOLH1ALDH1A1ALOX15SLC37A4 | |
| SCHEMBL1353325 | 0.86 | TSHR (0.47) | POLBFOLH1ALDH1A1ALOX15SLC37A4 | |
| SCHEMBL31296556 | 0.85 | ALDH1A1 (0.44) | POLBFOLH1ALDH1A1ALOX15KDM4E | |
| SCHEMBL25220694 | 0.83 | POLB (0.42) | POLBFOLH1ALDH1A1ALOX15SLC37A4 | |
| SCHEMBL1971894 | 0.83 | POLB (0.42) | POLBFOLH1ALDH1A1ALOX15SLC37A4 | |
| SCHEMBL133469 | 0.82 | ALDH1A1 (0.52) | POLBFOLH1ALDH1A1ALOX15KDM4E | |
| SCHEMBL409572 | 0.82 | SLC37A4 (0.45) | POLBFOLH1ALDH1A1ALOX15SLC37A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 127 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115368608-B | Polyimide composite film for flexible metal-clad foil substrate | 达迈科技股份有限公司 | 2024-02-09 | — | — | CN | claimed |
| CN-102838947-B | Modifier for adhesive, method for producing same, adhesive, and circuit connection structure | 日立化成株式会社 | 2019-01-01 | — | — | CN | claimed |
| US-8546511-B2 | Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin composition | ARISAWA MFG. CO., LTD. (JP) | 2013-10-01 | — | — | US | claimed |
| EP-0362649-B1 | Radiation-sensitive compositions and their use | BASF AG (DE) | 1994-03-02 | — | — | EP | claimed |
| US-5284734-A | Insulating layers and printed circuits; precursors for polyimides and polyquinazolines | BASF AKTIENGESELLSCHAFT (DE) | 1994-02-08 | — | — | US | claimed |
| EP-0362649-A2 | Radiation-sensitive compositions and their use | BASF Aktiengesellschaft (DE) | 1990-04-11 | — | — | EP | claimed |
| EP-0356172-A2 | Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-02-28 | — | — | EP | claimed |
| WO-2025058045-A1 | ADHESIVE FILM, METHOD FOR PRODUCING ADHESIVE FILM, ADHESIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 積水化学工業株式会社 | 2025-03-20 | — | — | WO | disclosed |
| WO-2024224735-A1 | RESIN COMPOSITION, INSULATED WIRE, AND METHOD FOR PRODUCING INSULATED WIRE | 住友電工ウインテック株式会社 | 2024-10-31 | — | — | WO | disclosed |
| WO-2024218834-A1 | RESIN COMPOSITION, INSULATED WIRE, AND METHOD FOR PRODUCING INSULATED WIRE | 住友電気工業株式会社 | 2024-10-24 | — | — | WO | disclosed |
| WO-2024157378-A1 | RESIN COMPOSITION, INSULATED WIRE, AND METHOD FOR PRODUCING INSULATED WIRE | 住友電気工業株式会社 | 2024-08-02 | — | — | WO | disclosed |
| CN-118388762-A | Imide resin, thermosetting resin composition, and cured product thereof | DIC株式会社 | 2024-07-26 | — | — | CN | disclosed |
| WO-2024154729-A1 | ADHESIVE FILM, TEMPORARY FIXING MATERIAL, CURED PRODUCT, LAMINATE, AND METHOD OF PRODUCING ELECTRONIC COMPONENT | 積水化学工業株式会社 | 2024-07-25 | — | — | WO | disclosed |
| EP-0437732-A1 | Method for preparing polyamic acids and polyimides | BASF Lacke + Farben AG (DE) | 1991-07-24 | — | — | EP | disclosed |
| EP-0384712-A2 | Carbon-fiber-reinforced polyimide resin compositions | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-08-29 | — | — | EP | disclosed |
| EP-0362649-A2 | Radiation-sensitive compositions and their use | BASF Aktiengesellschaft (DE) | 1990-04-11 | — | — | EP | disclosed |
| EP-0362644-A1 | Radiation-sensitive compositions and their use | BASF Aktiengesellschaft (DE) | 1990-04-11 | — | — | EP | disclosed |
| EP-0356172-A2 | Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-02-28 | — | — | EP | disclosed |
| EP-0350958-A2 | Improved polyimide and polyimide film and manufacturing method thereof | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1990-01-17 | — | — | EP | disclosed |
| EP-0083690-B1 | POLYAMIDE ACID COMPOSITION FOR PREPARING POLYIMIDE AND PROCESS FOR PREPARING POLYIMIDE FROM THE SAME | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1986-03-12 | — | — | EP | disclosed |