SCHEMBL9908424

SCHEMBL9908424

CC(=O)OCCCC1CC2CCC1C2

nearest known ligand 0.44

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.40
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
RAB9A P51151 2/20 0.38
NPC1 O15118 1/20 0.38
SIRT5 Q9NXA8 1/20 0.36
EPHX2 P34913 3/20 0.35
RXFP1 Q9HBX9 1/20 0.34
LMNA P02545 3/20 0.34
KDM4E B2RXH2 1/20 0.33
TP53 P04637 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
HSD17B10 Q99714 1/20 0.33
POLB P06746 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11703864 0.85 TSHR (0.44) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL17548677 0.83 MEN1 (0.35) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL18469152 0.81 MEN1 (0.34) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL16744377 0.80 FKBP1A (0.37) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL9517788 0.80 MEN1 (0.41) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL19819917 0.79 MEN1 (0.35) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL21262914 0.79 ALDH1A1 (0.34) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL32688864 0.78 MEN1 (0.41) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL18469151 0.77 EPHX2 (0.32) MEN1KMT2ARAB9ANPC1SIRT5
SCHEMBL32688906 0.76 EPHX2 (0.41) ALDH1A1SIRT5EPHX2NPSR1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9448482-B2 Pattern forming method, resist pattern formed by the method, method for manufacturing electronic device using the same, and electronic device FUJIFILM CORPORATION (JP) 2016-09-20 US disclosed
US-20150253673-A1 PATTERN FORMING METHOD, RESIST PATTERN FORMED BY THE METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-09-10 US disclosed
US-8198016-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-06-12 US disclosed
US-20090286188-A1 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-11-19 US disclosed