SCHEMBL991276

SCHEMBL991276

C=C(C)C(=O)OC(CCl)COP(=O)(O)O

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
PGD P52209 4/20 0.41
LPAR3 Q9UBY5 5/20 0.38
ENPP2 Q13822 5/20 0.38
LPAR1 Q92633 5/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
TSHR P16473 1/20 0.37
PGK1 P00558 1/20 0.37
PGK2 P07205 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14368419 0.90 PGD (0.45) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL20673 0.85 S1PR1 (0.43) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL2638511 0.85 PGD (0.42) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL243351 0.84 TSHR (0.49) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL26105729 0.83 ENPP2 (0.43) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL3283181 0.83 PGD (0.40) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL1130699 0.80 TSHR (0.43) TSHR
SCHEMBL15752950 0.80 ENPP2 (0.47) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL632720 0.80 TSHR (0.41) PGDLPAR3ENPP2LPAR1SMN1; SMN2
SCHEMBL26109390 0.79 LPAR3 (0.49) LPAR3ENPP2LPAR1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2248835-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2015-10-14 EP claimed
WO-2023167201-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT 株式会社カネカ 2023-09-07 WO disclosed
EP-2248835-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2015-10-14 EP disclosed
US-20110009517-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2011-01-13 US disclosed
EP-2248835-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2010-11-10 EP disclosed
US-7420014-B2 Thickener for water-based vibration damper NIPPON SHOKUBAI CO., LTD. (JP) 2008-09-02 US disclosed
EP-1847581-A1 SOLID ADHESIVE AGENT AND RAW MATERIAL COMPOSITION FOR THE SAME Nippon Shokubai Co., Ltd. (JP) 2007-10-24 EP disclosed
EP-1403347-B1 Thickener for water-based vibration damper NIPPON CATALYTIC CHEM IND (JP) 2006-11-15 EP disclosed
US-20040072943-A1 Thickener for water-based vibration damper NIPPON SHOKUBAI CO., LTD. (JP) 2004-04-15 US disclosed
EP-1403347-A1 Thickener for water-based vibration damper Nippon Shokubai Co., Ltd. (JP) 2004-03-31 EP disclosed