SCHEMBL9921277

SCHEMBL9921277

CC(N)C(=O)NNC(=O)C(N)N

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
DPP4 P27487 3/20 0.44
SLC15A1 P46059 1/20 0.38
SLC7A5 Q01650 1/20 0.38
TAAR1 Q96RJ0 1/20 0.35
DPP8 Q6V1X1 2/20 0.34
DPP7 Q9UHL4 2/20 0.34
PAX8 Q06710 1/20 0.33
XIAP P98170 1/20 0.33
BIRC2 Q13490 1/20 0.33
CTRB1 P17538 3/20 0.32
IDO1 P14902 2/20 0.32
FAP Q12884 1/20 0.32
DPP9 Q86TI2 1/20 0.32
LTA4H P09960 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30539211 0.83 DPP4 (0.44) DPP4SLC15A1SLC7A5TAAR1DPP8
SCHEMBL9367904 0.83 DPP4 (0.44) DPP4SLC15A1SLC7A5TAAR1DPP8
SCHEMBL30539272 0.81 DPP4 (0.43) DPP4SLC15A1SLC7A5TAAR1DPP8
SCHEMBL19088344 0.78
SCHEMBL24754047 0.75 DPP4 (0.39) DPP4SLC15A1TAAR1DPP8DPP7
SCHEMBL29037429 0.74 DPP4 (0.38) DPP4SLC15A1SLC7A5TAAR1DPP8
SCHEMBL29037427 0.74 DPP4 (0.38) DPP4SLC15A1SLC7A5TAAR1DPP8
SCHEMBL169096 0.73 SLC15A1 (0.58) DPP4SLC15A1SLC7A5TAAR1DPP8
SCHEMBL2845616 0.71
SCHEMBL2132099 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9169339-B2 Curable composition, molded product and method for producing molded product DAIKIN INDUSTRIES, LTD. (JP) 2015-10-27 US disclosed
US-20130190456-A1 CURABLE COMPOSITION, MOLDED ARTICLE AND METHOD FOR PRODUCING MOLDED ARTICLE DAIKIN INDUSTRIES, LTD. (JP) 2013-07-25 US disclosed
WO-2012077583-A1 CURABLE COMPOSITION, MOLDED PRODUCT AND METHOD FOR PRODUCING MOLDED PRODUCT DAIKIN INDUSTRIES, LTD. (JP) 2012-06-14 WO disclosed