⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27065 | 0.94 | — | — | |
| SCHEMBL8073104 | 0.89 | — | — | |
| Ether SCHEMBL41293 | 0.80 | ALDH1A1 (0.39) | — | |
| Ammonia Solution, Strong SCHEMBL10945668 | 0.80 | — | — | |
| SCHEMBL5013419 | 0.80 | — | — | |
| Benzene SCHEMBL7930559 | 0.80 | LTA4H (0.33) | — | |
| Alcohol SCHEMBL11759376 | 0.77 | ALDH1A1 (0.50) | — | |
| SCHEMBL28252804 | 0.77 | ALDH1A1 (0.32) | — | |
| SCHEMBL3288791 | 0.74 | — | — | |
| Bicarbonate SCHEMBL10901198 | 0.74 | ALDH1A1 (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107735854-B | Sinterable adhesive material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-12-15 | — | — | CN | disclosed |
| CN-107112246-B | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-11-10 | — | — | CN | disclosed |
| CN-107735854-A | Sinterable jointing material and use its semiconductor device | 汉高股份有限及两合公司 | 2018-02-23 | — | — | CN | disclosed |
| CN-107112246-A | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2017-08-29 | — | — | CN | disclosed |
| CN-102596486-B | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2015-06-24 | — | — | CN | disclosed |
| US-8950652-B2 | Metal paste with oxidizing agents | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-02-10 | — | — | US | disclosed |
| US-20150021378-A1 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS | Heraeus Deutschland GmbH & Co. KG (DE) | 2015-01-22 | — | — | US | disclosed |
| CN-102386149-B | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2014-12-03 | — | — | CN | disclosed |
| CN-102596486-A | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2012-07-18 | — | — | CN | disclosed |
| US-20120153011-A1 | METAL PASTE WITH OXIDIZING AGENTS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| CN-102386149-A | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2012-03-21 | — | — | CN | disclosed |