SCHEMBL9947154

SCHEMBL9947154

N#CC1CC2CC(=O)OC1C2O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13263374 0.79 SMN1; SMN2 (0.38)
SCHEMBL13146123 0.76 SMN1; SMN2 (0.31)
SCHEMBL14491206 0.75
SCHEMBL12845729 0.72
SCHEMBL12845730 0.71
SCHEMBL13081846 0.71 PRKCA (0.30)
SCHEMBL10134648 0.71
SCHEMBL3230743 0.70 GABRR1 (0.30)
SCHEMBL14531162 0.69 SMN1; SMN2 (0.32)
SCHEMBL178470 0.68 HMGCR (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130011619-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2013-01-10 US disclosed
US-20120288691-A1 PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-11-15 US disclosed
US-8236971-B2 Polycyclic ester containing cyano group and lactone skeleton DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2012-08-07 US disclosed
US-20120171618-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING A PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2012-07-05 US disclosed
US-20120156617-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-06-21 US disclosed
US-20120148957-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-06-14 US disclosed
US-20120076997-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2012-03-29 US disclosed
US-20110236828-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2011-09-29 US disclosed
WO-2011087144-A1 PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-07-21 WO disclosed
WO-2011083872-A1 PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-07-14 WO disclosed
WO-2011043481-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-04-14 WO disclosed
WO-2011025065-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2011-03-03 WO disclosed
US-20110028743-A1 POLYCYCLIC ESTER CONTAINING CYANO GROUP AND LACTONE SKELETON INOUE KEIZO 2011-02-03 US disclosed
US-20100297555-A1 MONOMER HAVING ELECTRON-WITHDRAWING SUBSTITUENT AND LACTONE SKELETON, POLYMERIC COMPOUND, AND PHOTORESIST COMPOSITION DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-11-25 US disclosed
US-7834114-B2 Polycyclic ester containing cyano group and lactone skeleton DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-11-16 US disclosed
US-7750101-B2 Polycyclic ester containing cyano group and lactone skeleton DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-07-06 US disclosed
WO-2010067905-A2 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2010-06-17 WO disclosed
US-20100081778-A1 POLYCYCLIC ESTER CONTAINING CYANO GROUP AND LACTONE SKELETON INOUE KEIZO 2010-04-01 US disclosed
US-20080319160-A1 Polycyclic Ester Containing Cyano Group and Lactone Skeleton DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2008-12-25 US disclosed