Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR1 | O14842 | 1/20 | 0.38 |
| ▸ | CPT2 | P23786 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | HMGCR | P04035 | 1/20 | 0.34 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.34 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.34 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.34 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9958682 | 0.81 | HMGCR (0.37) | FFAR1CPT2TDP1HMGCRCHRM1 | |
| SCHEMBL14837436 | 0.78 | — | — | |
| SCHEMBL540504 | 0.76 | ALDH1A1 (0.35) | FFAR1CPT2TDP1HMGCRCHRM1 | |
| SCHEMBL17997999 | 0.72 | HMGCR (0.38) | FFAR1CPT2TDP1HMGCRCHRM1 | |
| SCHEMBL3483802 | 0.71 | TSHR (0.31) | CYP2D6TSHRCYP2C19HIF1A | |
| SCHEMBL10577212 | 0.71 | HMGCR (0.55) | FFAR1CPT2TDP1HMGCRCHRM1 | |
| SCHEMBL17998000 | 0.69 | HMGCR (0.42) | FFAR1CPT2TDP1HMGCRCHRM1 | |
| Glycolic Acid SCHEMBL3678490 | 0.69 | — | — | |
| SCHEMBL10577709 | 0.66 | HMGCR (0.44) | FFAR1CPT2TDP1HMGCRCHRM1 | |
| SCHEMBL2477881 | 0.66 | LDHA (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |