SCHEMBL9960755

SCHEMBL9960755

[CH]C(=O)C(C=C)S(=O)(=O)CC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL250245 0.79
SCHEMBL5250874 0.69
SCHEMBL170596 0.66
SCHEMBL303281 0.66
SCHEMBL3345520 0.64
SCHEMBL11499750 0.64
SCHEMBL9274761 0.64 RNPEP (0.32)
SCHEMBL11668134 0.64 ALDH1A1 (0.31)
SCHEMBL14955465 0.62
SCHEMBL12274522 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240231235-A1 METHOD FOR TESTING PHOTOSENSITIVE COMPOSITION AND METHOD FOR PRODUCING PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2024-07-11 US disclosed
US-20240210822-A1 SWITCHABLE SUBSTRATE FOR EXTREME ULTRAVIOLET OR E-BEAM METALLIC RESIST TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-06-27 US disclosed
US-20230108447-A1 METHOD FOR INSPECTING PHOTOSENSITIVE COMPOSITION AND METHOD FOR PRODUCING PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2023-04-06 US disclosed
US-20230097195-A1 METHOD FOR INSPECTING CHEMICAL SOLUTION, METHOD FOR PRODUCING CHEMICAL SOLUTION, METHOD FOR CONTROLLING CHEMICAL SOLUTION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, METHOD FOR INSPECTING RESIST COMPOSITION, METHOD FOR PRODUCING RESIST COMPOSITION, METHOD FOR CONTROLLING RESIST COMPOSITION, AND METHOD FOR CHECKING CONTAMINATION STATUS OF SEMICONDUCTOR MANUFACTURING APPARATUS FUJIFILM CORPORATION (JP) 2023-03-30 US disclosed
EP-2891014-B1 PATTERN FORMING METHOD, AND ELECTRONIC DEVICE PRODUCING METHOD USING THE SAME FUJIFILM CORP (JP) 2017-11-29 EP disclosed
US-9651863-B2 Pattern forming method, active light sensitive or radiation sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-05-16 US disclosed
US-20160291461-A1 PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, ELECTRONIC DEVICE, BLOCK COPOLYMER AND BLOCK COPOLYMER PRODUCTION METHOD FUJIFILM CORPORATION (JP) 2016-10-06 US disclosed
US-20160041465-A1 PATTERN FORMING METHOD, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-02-11 US disclosed
EP-2891014-A1 PATTERN FORMING METHOD, AND, ELECTRONIC DEVICE PRODUCING METHOD AND ELECTRONIC DEVICE, EACH USING THE SAME FUJIFILM Corporation (JP) 2015-07-08 EP disclosed
WO-2014142360-A1 METHOD OF FORMING PATTERN, ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, PROCESS FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2014-09-18 WO disclosed
EP-2776889-A1 ACTINIC RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY- OR RADIATION-SENSITIVE FILM AND METHOD OF FORMING PATTERN FUJIFILM Corporation (JP) 2014-09-17 EP disclosed
WO-2014034578-A1 PATTERN FORMING METHOD, AND, ELECTRONIC DEVICE PRODUCING METHOD AND ELECTRONIC DEVICE, EACH USING THE SAME FUJIFILM CORPORATION (JP) 2014-03-06 WO disclosed
WO-2013172466-A1 METHOD FOR FORMING NEGATIVE PATTERN, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE AND ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION FUJIFILM CORPORATION (JP) 2013-11-21 WO disclosed
WO-2013069753-A1 ACTINIC RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY- OR RADIATION-SENSITIVE FILM AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2013-05-16 WO disclosed
WO-2012086849-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-06-28 WO disclosed