SCHEMBL996388

SCHEMBL996388

CCC(C)(C)c1cc(C)cc(C(C)(C)CC)c1C(Oc1ccccc1)C(CO)(CO)CO

nearest known ligand 0.34

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 1/20 0.34
POLB P06746 1/20 0.34
CYP2C9 P11712 1/20 0.34
RAB9A P51151 1/20 0.34
CASP1 P29466 1/20 0.32
MAPK14 Q16539 1/20 0.31
MAPT P10636 2/20 0.31
MEN1 O00255 1/20 0.31
ALDH1A1 P00352 1/20 0.31
GLA P06280 1/20 0.31
HPGD P15428 1/20 0.31
KMT2A Q03164 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
PPARG P37231 2/20 0.30
PPARA Q07869 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8926701 0.89
SCHEMBL997810 0.88 SMN1; SMN2 (0.35) POLBCYP2C9MAPK14ALDH1A1TDP1
SCHEMBL28062585 0.86 NPC1 (0.32) NPC1POLBCYP2C9RAB9AMAPK14
SCHEMBL995221 0.84
Pyrophosphoric Acid SCHEMBL11219971 0.80 ACP3 (0.32) CYP2C9MAPK14MEN1ALDH1A1KMT2A
SCHEMBL28827517 0.74 MEN1 (0.32) CYP2C9MAPK14MEN1ALDH1A1KMT2A
SCHEMBL11219967 0.72 ALDH1A1 (0.35) ALDH1A1
SCHEMBL996121 0.72 CYP3A4 (0.31)
SCHEMBL999178 0.72 ALDH1A1 (0.35) POLBCYP2C9ALDH1A1TDP1
SCHEMBL11123759 0.72 PPARG (0.41) NPC1RAB9AMAPTMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3604447-B1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE ASAHI CHEMICAL IND (JP) 2023-08-16 EP disclosed
WO-2023120457-A1 POLYAMIDE COMPOSITION 株式会社クラレ 2023-06-29 WO disclosed
CN-110527289-B Polyamide resin pellet, process for producing the same, and process for producing polyamide composition 旭化成株式会社 2022-08-26 CN disclosed
CN-114773841-A Polyamide composition and molded article 旭化成株式会社 2022-07-22 CN disclosed
CN-112708269-B Halogen-free flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product 金发科技股份有限公司 2022-07-08 CN disclosed
CN-110506079-B Polyamide composition and molded article 旭化成株式会社 2022-03-22 CN disclosed
CN-114133559-A Process for preparing semiaromatic polyamides with reduced salt formation cycle, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2022-03-04 CN disclosed
CN-114133560-A Process for preparing semiaromatic polyamides with improved impact strength, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2022-03-04 CN disclosed
CN-114058008-A Process for preparing semi-aromatic polyamides end-capped with monocarboxylic acids, semi-aromatic polyamides and molding compositions 山东广垠新材料有限公司 2022-02-18 CN disclosed
CN-114058009-A Process for preparing semi-aromatic polyamides with reduced loss of diamine monomer, semi-aromatic polyamides and molding compositions 山东广垠新材料有限公司 2022-02-18 CN disclosed
US-20080199793-A1 Electrophotographic photoreceptor having excellent electrical properties and image quality and their high stabilities and electrophotographic imaging apparatus employing the same SAMSUNG ELECTRONICS CO., LTD 2008-08-21 US disclosed
US-20070026327-A1 Electrophotographic photoreceptor for preventing image deterioration from repeated use and electrophotographic image forming apparatus employing the photoreceptor SAMSUNG ELECTRONICS CO., LTD. 2007-02-01 US disclosed
US-6265472-B1 BLEND CONTAINING COPPER PHTHALOCYANINE ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 2001-07-24 US disclosed
US-5286588-A Includes a hydroquinone compound having at least one group which contains four or more carbon atoms RICOH COMPANY, LTD. (JP) 1994-02-15 US disclosed
US-4888371-A HEAT RESISTANCE, LIGHT RESISTANCE ADEKA ARGUS CHEMICAL CO., LTD. (JP) 1989-12-19 US disclosed
EP-0255097-A2 Process for improving resistance to deterioration when exposed to sterilizing radiation of polyolefin resins ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1988-02-03 EP disclosed
EP-0143464-B1 PENTAERYTHRITOL-SPIRO-BIS-PHOSPHITE COMPOSITIONS HAVING IMPROVED HYDROLYTIC STABILITY Argus Chemical Corporation (US) 1987-07-08 EP disclosed
EP-0143464-A2 Pentaerythritol-spiro-bis-phosphite compositions having improved hydrolytic stability Argus Chemical Corporation (US) 1985-06-05 EP disclosed
US-4371647-A 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resin ADEKA ARGUS CHEMICAL CO. LTD. (JP) 1983-02-01 US disclosed
EP-0038876-A1 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resins, stabilizer compositions comprising phenolic antioxidants and such phosphites, and synthetic resin compositions containing the same ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1981-11-04 EP disclosed