SCHEMBL995221

SCHEMBL995221

CCC(C)(C)c1cc(C)cc(C(C)(C)CC)c1OC(c1c(C(C)(C)CC)cc(C)cc1C(C)(C)CC)C(CO)(CO)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL996121 0.87 CYP3A4 (0.31)
SCHEMBL996120 0.85 CNR2 (0.37)
SCHEMBL7639657 0.85 RXRA (0.35)
SCHEMBL996388 0.84 NPC1 (0.34)
SCHEMBL77036 0.84 SMN1; SMN2 (0.39)
Phosphine SCHEMBL3163238 0.82 SMN1; SMN2 (0.38)
SCHEMBL192004 0.80 SMN1; SMN2 (0.36)
SCHEMBL313283 0.80 SMN1; SMN2 (0.36)
Pyrophosphoric Acid SCHEMBL17255562 0.79
SCHEMBL999178 0.79 ALDH1A1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114672154-B Semi-aromatic polyamide molding composition for LED 金发科技股份有限公司 2024-04-02 CN disclosed
CN-114133560-B Process for the preparation of semiaromatic polyamides with improved impact strength, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2024-03-08 CN disclosed
CN-112601776-B Polyamide and polyamide composition 株式会社可乐丽 2024-01-02 CN disclosed
US-20230415395-A1 MOLDED ARTICLE, PRODUCTION METHOD FOR LASER-MARKED MOLDED ARTICLE, AND LASER MARKING METHOD ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-12-28 US disclosed
CN-114058009-B Process for the preparation of semi-aromatic polyamides with reduced diamine monomer loss, semi-aromatic polyamides and molding compositions 山东广垠新材料有限公司 2023-11-10 CN disclosed
EP-3604447-B1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE ASAHI CHEMICAL IND (JP) 2023-08-16 EP disclosed
CN-110964316-B Polyamide composition, molded article, and semi-aromatic polyamide 旭化成株式会社 2023-02-17 CN disclosed
CN-114773841-A Polyamide composition and molded article 旭化成株式会社 2022-07-22 CN disclosed
CN-112708269-B Halogen-free flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product 金发科技股份有限公司 2022-07-08 CN disclosed
CN-114672154-A Semi-aromatic polyamide molding composition for LED 金发科技股份有限公司 2022-06-28 CN disclosed
US-20060257706-A1 POLYMER ELECTROLYTE COMPOSITION AND FUEL CELL HIDAKA YASUAKI 2006-11-16 US disclosed
US-20030113605-A1 Polymer electrolyte composition and fuel cell SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-06-19 US disclosed
EP-1289041-A2 Polymer electrolyte composition and fuel cell SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-03-05 EP disclosed
US-6265472-B1 BLEND CONTAINING COPPER PHTHALOCYANINE ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 2001-07-24 US disclosed
US-4888371-A HEAT RESISTANCE, LIGHT RESISTANCE ADEKA ARGUS CHEMICAL CO., LTD. (JP) 1989-12-19 US disclosed
EP-0255097-A2 Process for improving resistance to deterioration when exposed to sterilizing radiation of polyolefin resins ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1988-02-03 EP disclosed
EP-0143464-B1 PENTAERYTHRITOL-SPIRO-BIS-PHOSPHITE COMPOSITIONS HAVING IMPROVED HYDROLYTIC STABILITY Argus Chemical Corporation (US) 1987-07-08 EP disclosed
EP-0143464-A2 Pentaerythritol-spiro-bis-phosphite compositions having improved hydrolytic stability Argus Chemical Corporation (US) 1985-06-05 EP disclosed
US-4371647-A 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resin ADEKA ARGUS CHEMICAL CO. LTD. (JP) 1983-02-01 US disclosed
EP-0038876-A1 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resins, stabilizer compositions comprising phenolic antioxidants and such phosphites, and synthetic resin compositions containing the same ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1981-11-04 EP disclosed