Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES1 | P23141 | 14/20 | 0.38 |
| ▸ | CES2 | O00748 | 2/20 | 0.35 |
| ▸ | LPAR1 | Q92633 | 1/20 | 0.35 |
| ▸ | LPAR3 | Q9UBY5 | 1/20 | 0.35 |
| ▸ | FAAH | O00519 | 8/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25948178 | 1.00 | CES1 (0.38) | CES1CES2LPAR1LPAR3FAAH | |
| SCHEMBL30156510 | 1.00 | CES1 (0.38) | CES1CES2LPAR1LPAR3FAAH | |
| SCHEMBL493979 | 0.92 | CES2 (0.43) | CES1CES2LPAR1LPAR3 | |
| SCHEMBL21087422 | 0.90 | CES2 (0.47) | CES1CES2LPAR1LPAR3 | |
| SCHEMBL13684033 | 0.90 | CES2 (0.47) | CES1CES2LPAR1LPAR3 | |
| SCHEMBL11990032 | 0.83 | ALDH1A1 (0.35) | CES1 | |
| SCHEMBL11990036 | 0.83 | ALDH1A1 (0.35) | CES1 | |
| SCHEMBL92887 | 0.83 | ALDH1A1 (0.35) | CES1 | |
| SCHEMBL22624064 | 0.81 | CES1 (0.33) | CES1CES2LPAR1LPAR3FAAH | |
| SCHEMBL5857345 | 0.80 | ALDH1A1 (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8916978-B2 | Interconnect structure and method of fabricating | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-12-23 | — | — | US | disclosed |
| US-8487411-B2 | Multiple patterning using improved patternable low-κ dielectric materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-07-16 | — | — | US | disclosed |
| US-8475667-B2 | Method of patterning photosensitive material on a substrate containing a latent acid generator | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-07-02 | — | — | US | disclosed |
| US-8470516-B2 | Method of forming a relief pattern by e-beam lithography using chemical amplification, and derived articles | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-06-25 | — | — | US | disclosed |
| US-8461039-B2 | Patternable low-K dielectric interconnect structure with a graded cap layer and method of fabrication | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-06-11 | — | — | US | disclosed |
| US-8415248-B2 | Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-04-09 | — | — | US | disclosed |
| US-20130009323-A1 | INTERCONNECT STRUCTURE AND METHOD OF FABRICATING | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-01-10 | — | — | US | disclosed |
| US-20120252204-A1 | PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-10-04 | — | — | US | disclosed |
| US-20120231622-A1 | SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K MATERIAL AND METHODS OF FORMING SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-09-13 | — | — | US | disclosed |
| US-20120161296-A1 | MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-06-28 | — | — | US | disclosed |
| US-8202783-B2 | Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-06-19 | — | — | US | disclosed |
| US-20110074044-A1 | PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-03-31 | — | — | US | disclosed |
| US-20110045387-A1 | Method of Forming a Relief Pattern by E-Beam Lithography Using Chemical Amplification, and Derived Articles | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-02-24 | — | — | US | disclosed |