SCHEMBL9979404

SCHEMBL9979404

CCC(C)(CC)CC(C(=O)O)C(F)(F)F

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
HSPD1 P10809 1/20 0.32
BLM P54132 1/20 0.32
HSPE1 P61604 1/20 0.32
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12044154 0.83
SCHEMBL12784233 0.81 HSPD1 (0.33) HSPD1BLMHSPE1
SCHEMBL17469430 0.75 CHRM1 (0.35) HSPD1BLMHSPE1
SCHEMBL363488 0.75 HTT (0.31)
SCHEMBL2035661 0.75 CHRM1 (0.35) HSPD1BLMHSPE1
SCHEMBL7638052 0.73 CHRM1 (0.33) HSPD1BLMHSPE1
Hydrochloric Acid SCHEMBL28492070 0.73 CHRM1 (0.33) HSPD1BLMHSPE1
SCHEMBL9362444 0.71
SCHEMBL826185 0.71 CHRM1 (0.48) HSPD1BLMHSPE1
SCHEMBL28985420 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130009323-A1 INTERCONNECT STRUCTURE AND METHOD OF FABRICATING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-01-10 US disclosed
US-20120301980-A1 METHODOLOGY FOR EVALUATION OF ELECTRICAL CHARACTERISTICS OF CARBON NANOTUBES INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-11-29 US disclosed
US-20120252204-A1 PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-10-04 US disclosed
US-20120161296-A1 MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-28 US disclosed
US-8202783-B2 Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-19 US disclosed
US-20110309507-A1 METHODOLOGY FOR EVALUATION OF ELECTRICAL CHARACTERISTICS OF CARBON NANOTUBES INTERNATIONAL BUSINESS MACHINES CORP. (US) 2011-12-22 US disclosed
US-7919225-B2 Photopatternable dielectric materials for BEOL applications and methods for use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-04-05 US disclosed
US-20110074044-A1 PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-03-31 US disclosed
US-7867689-B2 Method of use for photopatternable dielectric materials for BEOL applications INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-01-11 US disclosed
US-20100319971-A1 AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH IMPROVED PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-12-23 US disclosed
US-20090291389-A1 PHOTOPATTERNABLE DIELECTRIC MATERIALS FOR BEOL APPLICATIONS AND METHODS FOR USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-11-26 US disclosed
US-20080286467-A1 METHOD OF USE FOR PHOTOPATTERNABLE DIELECTRIC MATERIALS FOR BEOL APPLICATIONS GLOBALFOUNDRIES U.S. INC. 2008-11-20 US disclosed