SCHEMBL1002860

SCHEMBL1002860

C=COC(=O)C(C)(C)CC

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
TSHR P16473 1/20 0.32
THRB P10828 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL27259206 0.94
SCHEMBL21577393 0.84
SCHEMBL1002216 0.83 ELANE (0.42) ALDH1A1TSHR
SCHEMBL1001452 0.82 ALDH1A1 (0.32) ALDH1A1TSHRTHRB
SCHEMBL28971652 0.82 ALDH1A1 (0.33) ALDH1A1
SCHEMBL8383255 0.80
SCHEMBL6483002 0.80 CCR2 (0.32)
SCHEMBL8374615 0.80 KDM4E (0.31)
SCHEMBL8734117 0.80 ALDH1A1 (0.31) ALDH1A1TSHRTHRB
SCHEMBL7196375 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 174 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0222157-B1 RESIN COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-12-30 EP claimed
US-4886862-A MOISTURE-CURABLE SILYL-GROUP CONTAINING COPOLYMER OF A FLUOROALKYL PERVINYL ETHER AND A VINYL CARBOXYLATE, CATALYST AND SOLVENT; PAINTS; COATINGS, WEATHERPROOFING; HARDNESS DAINIPPON INK AND CHEMICALS, INC. (JP) 1989-12-12 US claimed
EP-0222157-A2 Resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-05-20 EP claimed
EP-4653500-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM Kyoeisha Chemical Co., Ltd. (JP) 2025-11-26 EP disclosed
US-20250270418-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM KYOEISHA CHEMICAL CO., LTD. (JP) 2025-08-28 US disclosed
US-20250011480-A1 CURABLE RESIN COMPOSITION KYOEISHA CHEMICAL CO., LTD. (JP) 2025-01-09 US disclosed
WO-2024189996-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM 共栄社化学株式会社 2024-09-19 WO disclosed
EP-4414426-A1 CURABLE RESIN COMPOSITION Kyoeisha Chemical Co., Ltd. (JP) 2024-08-14 EP disclosed
CN-114728306-B Thermosetting resin composition, cured film, method for forming multilayer coating film, ester compound, and polymer 共荣社化学株式会社 2024-06-14 CN disclosed
CN-118019808-A Curable resin composition 共荣社化学株式会社 2024-05-10 CN disclosed
EP-4239000-A1 COMPOSITION FOR FORMING LOW DIELECTRIC CONSTANT RESIN, LOW DIELECTRIC MEMBER, AND ELECTRONIC DEVICE USING SAME JNC Corporation (JP) 2023-09-06 EP disclosed
US-5212229-A MONODISPERSED ACRYLIC POLYMERS IN SUPERCRITICAL, NEAR SUPERCRITICAL AND SUBCRITICAL FLUIDS UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-05-18 US disclosed
EP-0222157-B1 RESIN COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-12-30 EP disclosed
EP-0506067-A1 Monodispersed thermoplastic acrylic polymers in supercritical fluids UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1992-09-30 EP disclosed
EP-0481431-A2 Pressurized fluid composition and process for making same UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION, Three Cristina Centre (US) 1992-04-22 EP disclosed
US-5106895-A Organosilicon compound as monomer; curable MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1992-04-21 US disclosed
EP-0430628-A1 Fluorine-containing copolymer composition MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-06-05 EP disclosed
US-4886862-A MOISTURE-CURABLE SILYL-GROUP CONTAINING COPOLYMER OF A FLUOROALKYL PERVINYL ETHER AND A VINYL CARBOXYLATE, CATALYST AND SOLVENT; PAINTS; COATINGS, WEATHERPROOFING; HARDNESS DAINIPPON INK AND CHEMICALS, INC. (JP) 1989-12-12 US disclosed
EP-0222157-A2 Resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-05-20 EP disclosed
US-4048130-A COPOLYMERIZATION, UNSATURATED ACIDS LONZA LTD. (CH) 1977-09-13 US disclosed