SCHEMBL7196375

SCHEMBL7196375

C=COC(=O)C(C)(C)CCl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28971652 0.84 ALDH1A1 (0.33)
SCHEMBL21577393 0.82
SCHEMBL1002860 0.80 ALDH1A1 (0.32)
SCHEMBL8383255 0.78
SCHEMBL8374615 0.78 KDM4E (0.31)
SCHEMBL6483002 0.78 CCR2 (0.32)
SCHEMBL1002216 0.77 ELANE (0.42)
SCHEMBL29184352 0.77 CYP4F2 (0.39)
SCHEMBL10823258 0.75 TSHR (0.38)
SCHEMBL9687076 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106187936-A Acrylonitrile compound and application thereof 湖南化工研究院有限公司 2016-12-07 CN claimed
EP-0222157-B1 RESIN COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-12-30 EP claimed
US-4886862-A MOISTURE-CURABLE SILYL-GROUP CONTAINING COPOLYMER OF A FLUOROALKYL PERVINYL ETHER AND A VINYL CARBOXYLATE, CATALYST AND SOLVENT; PAINTS; COATINGS, WEATHERPROOFING; HARDNESS DAINIPPON INK AND CHEMICALS, INC. (JP) 1989-12-12 US claimed
EP-0222157-A2 Resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-05-20 EP claimed
CN-114728306-B Thermosetting resin composition, cured film, method for forming multilayer coating film, ester compound, and polymer 共荣社化学株式会社 2024-06-14 CN disclosed
CN-118019808-A Curable resin composition 共荣社化学株式会社 2024-05-10 CN disclosed
CN-113646347-B Aqueous thermosetting resin composition and cured film 共荣社化学株式会社 2023-05-23 CN disclosed
WO-2023080228-A1 CURABLE RESIN COMPOSITION 共栄社化学株式会社 2023-05-11 WO disclosed
US-20230110863-A1 THERMOSETTING RESIN COMPOSITION AND TRANSESTERIFICATION REACTION CATALYST KYOEISHA CHEMICAL CO., LTD. (JP) 2023-04-13 US disclosed
US-11618816-B2 Method for forming a multilayer coating film and multilayer coating film KYOEISHA CHEMICAL CO., LTD. (JP) 2023-04-04 US disclosed
US-20230087596-A1 ESTER COMPOUND, METHOD FOR PRODUCING SAME, POLYMER, THERMOSETTING RESIN COMPOSITION AND CURED FILM KYOEISHA CHEMICAL CO., LTD. (JP) 2023-03-23 US disclosed
EP-4098696-A1 THERMOSETTING RESIN COMPOSITION AND TRANSESTERIFICATION REACTION CATALYST Kyoeisha Chemical Co., Ltd. (JP) 2022-12-07 EP disclosed
US-20190092889-A1 THERMOSETTING RESIN COMPOSITION KYOEISHA CHEMICAL CO., LTD. (JP) 2019-03-28 US disclosed
CN-106187936-A Acrylonitrile compound and application thereof 湖南化工研究院有限公司 2016-12-07 CN disclosed
EP-0735118-B1 POWDER COATING RESIN COMPOSITION DOW CORNING TORAY SILICONE (JP) 2003-07-23 EP disclosed
US-6090890-A EPOXY-FUNCTIONAL BRANCHED ORGANOPOLYSILOXANE AND AN ACRYLIC RESIN CONTAINING AROMATIC VINYL MONOMERIC UNITS IN AN AMOUNT OF FROM 5 TO 70 WT %, AND FLUORORESINS, SAID COMPOUND BEARING A FUNCTIONAL GROUP REACTIVE WITH THE EPOXY GROUP DOW CORNING TORAY SILICONE CO., LTD. (JP) 2000-07-18 US disclosed
EP-0735118-A1 POWDER COATING RESIN COMPOSITION Dow Corning Toray Silicone Co., Ltd. (JP) 1996-10-02 EP disclosed
EP-0222157-B1 RESIN COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-12-30 EP disclosed
US-4886862-A MOISTURE-CURABLE SILYL-GROUP CONTAINING COPOLYMER OF A FLUOROALKYL PERVINYL ETHER AND A VINYL CARBOXYLATE, CATALYST AND SOLVENT; PAINTS; COATINGS, WEATHERPROOFING; HARDNESS DAINIPPON INK AND CHEMICALS, INC. (JP) 1989-12-12 US disclosed
EP-0222157-A2 Resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-05-20 EP disclosed