SCHEMBL10033567

SCHEMBL10033567

CCC(C)C(=O)NCCC#N

nearest known ligand 0.51

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.42
USP2 O75604 1/20 0.42
GAA P10253 1/20 0.41
MCL1 Q07820 2/20 0.37
MAPT P10636 1/20 0.36
CTSS P25774 3/20 0.35
CTSK P43235 3/20 0.35
HSD17B10 Q99714 2/20 0.34
CYP3A4 P08684 1/20 0.33
MMP8 P22894 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14521485 0.82 KMT2A (0.41) TSHRUSP2MCL1MAPTCTSS
SCHEMBL14153993 0.81 TSHR (0.61) TSHRUSP2GAAMAPTHSD17B10
SCHEMBL21886619 0.80 CA1 (0.47) TSHRMMP8
SCHEMBL27340657 0.79 TSHR (0.41) TSHRUSP2MCL1MAPTCTSS
SCHEMBL2563763 0.78 ALDH1A1 (0.38) TSHRUSP2MCL1MAPTCTSS
SCHEMBL5021623 0.77 TSHR (0.50) TSHRUSP2GAAMCL1CYP3A4
SCHEMBL17853878 0.77 USP2 (0.50) TSHRUSP2GAAMMP8
SCHEMBL17527573 0.75 ALDH1A2 (0.52) TSHRUSP2GAAMMP8
SCHEMBL18685491 0.75 USP2 (0.54) TSHRUSP2GAAMAPTHSD17B10
SCHEMBL14238600 0.75 USP2 (0.54) TSHRUSP2GAAMAPTHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8202576-B2 Method of forming metal film FUJIFILM CORPORATION (JP) 2012-06-19 US disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-20100247880-A1 NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100080893-A1 METHOD OF FORMING METAL FILM FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed