SCHEMBL100560

SCHEMBL100560

CN(C)C(=O)Nc1ccc(Cc2ccc(NC(=O)N(C)C)cc2)cc1

nearest known ligand 0.66

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.63
CA12 O43570 1/20 0.56
CA1 P00915 1/20 0.56
CA2 P00918 1/20 0.56
CA9 Q16790 1/20 0.56
APEX1 P27695 1/20 0.53
POLB P06746 2/20 0.51
SAE1 Q9UBE0 1/20 0.51
UBA2 Q9UBT2 1/20 0.51
MEN1 O00255 1/20 0.50
LMNA P02545 1/20 0.50
KMT2A Q03164 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16276047 0.93 TSHR (0.63) TSHRCA12CA1CA2CA9
SCHEMBL687878 0.87 TSHR (0.79) TSHRCA12CA1CA2CA9
SCHEMBL8107899 0.86 GAA (0.57) TSHRPOLBSAE1UBA2MEN1
SCHEMBL14468490 0.86 TSHR (0.61) TSHRCA12CA1CA2CA9
SCHEMBL8531301 0.85 TSHR (0.59) TSHRCA12CA1CA2CA9
SCHEMBL11375896 0.85 TSHR (0.65) TSHRCA12CA1CA2CA9
SCHEMBL27831130 0.83 TSHR (0.46) TSHRCA12CA1CA2CA9
SCHEMBL3678231 0.83 TSHR (0.58) TSHRCA12CA1CA2CA9
SCHEMBL8867731 0.83 TSHR (0.58) TSHRCA12CA1CA2CA9
SCHEMBL8867740 0.83 TSHR (0.58) TSHRCA12CA1CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 583 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12460043-B2 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material THE YOKOHAMA RUBBER CO., LTD. (JP) 2025-11-04 US claimed
WO-2025093593-A1 ONE COMPONENT COMPOSITION BASED ON EPOXY RESINS HENKEL AG & CO. KGAA (DE) 2025-05-08 WO claimed
WO-2025093585-A1 ONE COMPONENT COMPOSITION BASED ON EPOXY RESINS HENKEL AG & CO. KGAA (DE) 2025-05-08 WO claimed
EP-4549484-A1 ONE COMPONENT COMPOSITION BASED ON EPOXY RESINS Henkel AG & Co. KGaA (DE) 2025-05-07 EP claimed
EP-4549483-A1 ONE COMPONENT COMPOSITION BASED ON EPOXY RESINS Henkel AG & Co. KGaA (DE) 2025-05-07 EP claimed
EP-3712192-B1 THERMOSETTING RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL AND PRODUCTION METHOD THEREFOR MITSUBISHI CHEM CORP (JP) 2024-08-21 EP claimed
EP-3347398-B1 ONE-COMPONENT TOUGHENED EPOXY ADHESIVES WITH IMPROVED ADHESION TO OILY SURFACES AND HIGH WASH-OFF RESISTANCE DDP SPECIALTY ELECTRONIC MATERIALS US LLC (US) 2024-07-31 EP claimed
US-20230183416-A1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL THE YOKOHAMA RUBBER CO., LTD. (JP) 2023-06-15 US claimed
US-11674063-B2 Epoxy resin adhesive compositions DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (US) 2023-06-13 US claimed
US-11618803-B2 Thermosetting resin composition, prepreg, and fiber-reinforced composite material and production method therefor MITSUBISHI CHEMICAL CORPORATION (JP) 2023-04-04 US claimed
US-20100151253-A1 Primer Compositions for Adhesive Bonding Systems HENKEL KGAA (DE) 2010-06-17 US claimed
EP-1996641-B1 USE OF A SUBSTITUTED GUANIDINE COMPOUND AS A HARDENER FOR EPOXY RESINS ALZCHEM TROSTBERG GMBH (DE) 2009-10-14 EP claimed
US-20080166511-A1 Epoxy Resin Composition for Carbon-Fiber-Reinforced Composite Material, Prepreg, Integrated Molding, Fiber-Reinforced Composite Sheet, and Casing for Electrical/Electronic Equipment TORAY INDUSTRIES INC. (JP) 2008-07-10 US claimed
EP-1902106-A1 PRIMER COMPOSITIONS FOR ADHESIVE BONDING SYSTEMS Henkel Corporation (US) 2008-03-26 EP claimed
WO-2007008199-A1 PRIMER COMPOSITIONS FOR ADHESIVE BONDING SYSTEMS HENKEL CORPORATION (US) 2007-01-18 WO claimed
EP-1731553-A1 EPOXY RESIN COMPOSITION FOR CARBON-FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, INTEGRATED MOLDING, SHEET OF FIBER-REINFORCED COMPOSITE MATERIAL AND CABINET FOR ELECTRICAL/ELECTRONIC EQUIPMENT TORAY INDUSTRIES, INC. (JP) 2006-12-13 EP claimed
EP-0804285-B1 ENCAPSULATED ACTIVE MATERIALS AND METHOD FOR PREPARING SAME DOW CHEMICAL CO (US) 1999-07-28 EP claimed
EP-0804285-A1 ENCAPSULATED ACTIVE MATERIALS AND METHOD FOR PREPARING SAME THE DOW CHEMICAL COMPANY (US) 1997-11-05 EP claimed
US-5601761-A Encapsulated active materials and method for preparing same THE DOW CHEMICAL COMPANY (US) 1997-02-11 US claimed
WO-1996009883-A1 ENCAPSULATED ACTIVE MATERIALS AND METHOD FOR PREPARING SAME THE DOW CHEMICAL COMPANY (US) 1996-04-04 WO claimed