SCHEMBL10065735

SCHEMBL10065735

CC(C)(C)CC(C(=O)OCCC#N)C(C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
DPP4 P27487 2/20 0.33
CTSS P25774 2/20 0.32
CTSK P43235 1/20 0.32
CTSL P07711 1/20 0.32
CTSB P07858 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19881289 0.85 MEN1 (0.36) MEN1KMT2ADPP4
SCHEMBL19277262 0.84 MEN1 (0.40) MEN1KMT2ADPP4CTSSCTSK
SCHEMBL13536915 0.81 CTSS (0.35) MEN1KMT2ADPP4CTSSCTSK
SCHEMBL10065742 0.81 MEN1 (0.34) MEN1KMT2ADPP4CTSSCTSK
SCHEMBL13114599 0.79 MEN1 (0.39) MEN1KMT2ADPP4CTSSCTSK
SCHEMBL24056618 0.78 ALDH1A1 (0.33)
SCHEMBL9054542 0.78 TSHR (0.33)
SCHEMBL12549371 0.78 HCAR2 (0.34)
SCHEMBL15468449 0.77 TSHR (0.35)
SCHEMBL20925310 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3219400-B1 SURFACE TREATMENT METHOD, ANTI-STATIC AGENT, AND HYDROPHILIZING TREATMENT AGENT TOKYO OHKA KOGYO CO LTD (JP) 2021-01-27 EP disclosed
EP-3219400-A2 SURFACE TREATMENT METHOD, ANTI-STATIC AGENT, AND HYDROPHILIZING TREATMENT AGENT Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-09-20 EP disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed