Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 5/20 | 0.58 |
| ▸ | PTGS1 | P23219 | 7/20 | 0.51 |
| ▸ | MEN1 | O00255 | 3/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.50 |
| ▸ | KCNMA1 | Q12791 | 4/20 | 0.48 |
| ▸ | LMNA | P02545 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | MAPT | P10636 | 1/20 | 0.45 |
| ▸ | AKT1 | P31749 | 1/20 | 0.45 |
| ▸ | POLB | P06746 | 1/20 | 0.45 |
| ▸ | PKM | P14618 | 1/20 | 0.45 |
| ▸ | APEX1 | P27695 | 1/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.45 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19445247 | 0.94 | PTGS1 (0.52) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL14502927 | 0.92 | HDAC1 (0.54) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL30713470 | 0.89 | PTGS1 (0.59) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL29167830 | 0.89 | PTGS1 (0.59) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL12510858 | 0.87 | MEN1 (0.51) | HDAC1MEN1KMT2AKCNMA1AKT1 | |
| SCHEMBL2605583 | 0.87 | HDAC1 (0.60) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL29838149 | 0.87 | HDAC1 (0.60) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL28502492 | 0.86 | HDAC1 (0.55) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL19600606 | 0.86 | HDAC1 (0.55) | HDAC1PTGS1MEN1KMT2AKCNMA1 | |
| SCHEMBL2605543 | 0.86 | KCNMA1 (0.62) | HDAC1MEN1KMT2AKCNMA1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118184586-A | Diamine with photopolymerization and preparation method and application thereof | 波米科技有限公司 | 2024-06-14 | — | — | CN | claimed |
| CN-114989433-A | Resin, positive photosensitive resin composition and application | 烟台三月科技有限责任公司 | 2022-09-02 | — | — | CN | claimed |
| CN-114524938-A | Polymer, photosensitive resin composition, cured film prepared from same and electronic element | 江苏三月科技股份有限公司 | 2022-05-24 | — | — | CN | claimed |
| WO-2025100308-A1 | RESIN COMPOSITION, CURED PRODUCT, AND DISPLAY DEVICE OR SEMICONDUCTOR DEVICE | 東レ株式会社 | 2025-05-15 | — | — | WO | disclosed |
| CN-119954849-A | Diamine monomer, slurry and polyimide film | 奥克控股集团股份公司 | 2025-05-09 | — | — | CN | disclosed |
| CN-119570027-B | Colored end-capped photosensitive polymer, preparation method and application thereof, black photoresist and black matrix | 上海明士华新材料有限公司 | 2025-04-18 | — | — | CN | disclosed |
| WO-2025066837-A1 | POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYIMIDE RESIN, AND PHOTOSENSITIVE CURED FILM | 上海八亿时空先进材料有限公司 | 2025-04-03 | — | — | WO | disclosed |
| CN-119570027-A | Colored end-capped photosensitive polymer, preparation method and application thereof, black photoresist and black matrix | 上海明士华新材料有限公司 | 2025-03-07 | — | — | CN | disclosed |
| CN-118184586-A | Diamine with photopolymerization and preparation method and application thereof | 波米科技有限公司 | 2024-06-14 | — | — | CN | disclosed |
| CN-114524938-B | Polymer, photosensitive resin composition, cured film prepared from polymer and photosensitive resin composition, and electronic element | 江苏三月科技股份有限公司 | 2024-02-09 | — | — | CN | disclosed |
| CN-116970276-B | Polyimide resin, photosensitive resin composition containing polyimide resin and photosensitive cured film | 上海八亿时空先进材料有限公司 | 2024-01-09 | — | — | CN | disclosed |
| US-20080193718-A1 | Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof | TORAY INDUSTRIES, INC. (JP) | 2008-08-14 | — | — | US | disclosed |
| US-20080108723-A1 | Photosensitive Resin Composition | TORAY INDUSTRIES, INC. (JP) | 2008-05-08 | — | — | US | disclosed |
| US-20080108723-A1 | Photosensitive Resin Composition | TORAY INDUSTRIES, INC. (JP) | 2008-05-08 | — | — | US | disclosed |
| EP-1862855-A1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2007-12-05 | — | — | EP | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |