SCHEMBL19600606

SCHEMBL19600606

CC(c1ccc(O)c(NC(=O)c2ccc(N)cc2)c1)(c1ccc(O)c(NC(=O)c2ccc(N)cc2)c1)C(F)(F)F

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 4/20 0.55
AKT1 P31749 1/20 0.49
PTGS1 P23219 7/20 0.49
KCNMA1 Q12791 4/20 0.49
MEN1 O00255 3/20 0.48
KMT2A Q03164 3/20 0.48
LMNA P02545 2/20 0.44
MAPT P10636 2/20 0.44
KDM4E B2RXH2 1/20 0.44
POLB P06746 1/20 0.43
PKM P14618 1/20 0.43
APEX1 P27695 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
GAA P10253 1/20 0.42
MAPK1 P28482 1/20 0.42
HDAC2 Q92769 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19986271 0.92 HDAC1 (0.52) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL19846834 0.88 KCNMA1 (0.60) HDAC1AKT1KCNMA1MEN1KMT2A
SCHEMBL12151323 0.88 HDAC1 (0.58) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL10069697 0.86 HDAC1 (0.58) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL13601071 0.86 HDAC1 (0.60) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL19986269 0.85 HDAC1 (0.59) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL17715190 0.85 MAPT (0.47) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL28502492 0.84 HDAC1 (0.55) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL28263715 0.83 HDAC1 (0.54) HDAC1AKT1PTGS1KCNMA1MEN1
SCHEMBL12937567 0.83 KCNMA1 (0.68) HDAC1AKT1KCNMA1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11860538-B2 Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device FUJIFILM CORPORATION (JP) 2024-01-02 US disclosed
US-20180222164-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-08-09 US disclosed
US-20180215874-A1 RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-08-02 US disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed