SCHEMBL2605583

SCHEMBL2605583

Nc1cccc(C(=O)Nc2cc(C(c3ccc(O)c(NC(=O)c4cccc(N)c4)c3)(C(F)(F)F)C(F)(F)F)ccc2O)c1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 3/20 0.60
PTGS1 P23219 5/20 0.57
SMN1; SMN2 Q16637 1/20 0.51
NPSR1 Q6W5P4 1/20 0.51
HSD17B10 Q99714 1/20 0.51
KCNMA1 Q12791 3/20 0.48
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
MAPT P10636 1/20 0.46
HDAC2 Q92769 1/20 0.46
PABPC1 P11940 1/20 0.45
DUSP3 P51452 1/20 0.45
PTPN5 P54829 1/20 0.45
PTPN11 Q06124 1/20 0.45
EIF4H Q15056 1/20 0.45
CTDSP1 Q9GZU7 1/20 0.45
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
KDM4C Q9H3R0 1/20 0.44
KDM4E B2RXH2 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29838149 1.00 HDAC1 (0.60) HDAC1PTGS1SMN1; SMN2NPSR1HSD17B10
SCHEMBL26078654 0.94 HDAC1 (0.55) HDAC1PTGS1SMN1; SMN2NPSR1HSD17B10
SCHEMBL25113710 0.91 PTGS1 (0.52) HDAC1PTGS1SMN1; SMN2NPSR1HSD17B10
SCHEMBL25132171 0.89 HDAC1 (0.50) HDAC1PTGS1SMN1; SMN2NPSR1HSD17B10
SCHEMBL12151323 0.88 HDAC1 (0.58) HDAC1PTGS1SMN1; SMN2NPSR1HSD17B10
SCHEMBL28384425 0.88 HDAC1 (0.58) HDAC1PTGS1SMN1; SMN2NPSR1HSD17B10
SCHEMBL25012600 0.88 HDAC1 (0.48) HDAC1PTGS1SMN1; SMN2NPSR1HSD17B10
SCHEMBL10069697 0.87 HDAC1 (0.58) HDAC1PTGS1KCNMA1MEN1KMT2A
SCHEMBL1871490 0.87 HDAC1 (0.60) HDAC1KCNMA1MEN1KMT2AHDAC2
SCHEMBL13213671 0.85 KCNMA1 (0.59) SMN1; SMN2KCNMA1MEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 146 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118341422-A Composite catalyst and preparation method and application thereof 山东阳谷华泰化工股份有限公司 2024-07-16 CN claimed
CN-118221936-A High-performance preparation method and application of polyimide 中国科学院化学研究所 2024-06-21 CN claimed
CN-117757070-A Polyimide resin capable of being cured at low temperature, photoresist composition and preparation method thereof 江苏艾森半导体材料股份有限公司 2024-03-26 CN claimed
CN-117466763-A Preparation method of 2, 2-bis [3- (3-aminobenzoylamino) -4-hydroxyphenyl ] hexafluoropropane 天津众泰材料科技有限公司 2024-01-30 CN claimed
CN-117430810-A Thermosetting polyimide resin and preparation method thereof 徐州博康信息化学品有限公司 2024-01-23 CN claimed
EP-4651185-A1 LAMINATE, SEMICONDUCTOR ELEMENT, AND MEMS ELEMENT Toray Industries, Inc. (JP) 2025-11-19 EP disclosed
EP-4651186-A1 METHOD FOR PRODUCING MULTILAYER BODY, AND RESIN COMPOSITION Toray Industries, Inc. (JP) 2025-11-19 EP disclosed
WO-2025100308-A1 RESIN COMPOSITION, CURED PRODUCT, AND DISPLAY DEVICE OR SEMICONDUCTOR DEVICE 東レ株式会社 2025-05-15 WO disclosed
WO-2025074871-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCTS OF SAME, AND ELECTRONIC COMPONENT AND DISPLAY DEVICE EACH USING SAID CURED PRODUCT 東レ株式会社 2025-04-10 WO disclosed
WO-2025047132-A1 RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, AND ORGANIC EL DISPLAY DEVICE 東レ株式会社 2025-03-06 WO disclosed
WO-2025005007-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT 東レ株式会社 2025-01-02 WO disclosed
WO-2024171805-A1 POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL DISPLAY DEVICE, AND ELECTRONIC COMPONENT 東レ株式会社 2024-08-22 WO disclosed
US-7977028-B2 Photosensitive resin composition and adhesion promoter TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
WO-2011080992-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 東レ株式会社 (JP) 2011-07-07 WO disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER TORAY INDUSTRIES, INC. (JP) 2009-05-14 US disclosed
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER TORAY INDUSTRIES, INC. (JP) 2009-05-14 US disclosed
EP-1909142-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER TORAY INDUSTRIES, INC. (JP) 2008-04-09 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER PCNA, TERB1, SMC2 HDAC1 1079/4885PTGS1 1602/4885SMN1; SMN2 3418/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.