SCHEMBL10087712

SCHEMBL10087712

CCC(C)(F)C(=O)OCOC1CCCC1

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.33
NAAA Q02083 2/20 0.32
FKBP1A P62942 2/20 0.31
CYP19A1 P11511 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10087711 0.98 EPHX1 (0.36) EPHX1NAAAFKBP1ACYP19A1
SCHEMBL10087713 0.98 EPHX1 (0.36) EPHX1NAAAFKBP1ACYP19A1
SCHEMBL824312 0.84 EPHX1 (0.32) EPHX1NAAA
SCHEMBL47524 0.83 HMGCR (0.40) EPHX1NAAAFKBP1ACYP19A1
SCHEMBL824238 0.83 EPHX1 (0.34) EPHX1NAAACYP19A1
SCHEMBL824245 0.83 EPHX1 (0.34) EPHX1NAAACYP19A1
SCHEMBL47408 0.82 HMGCR (0.40) EPHX1NAAAFKBP1ACYP19A1
SCHEMBL47512 0.82 HMGCR (0.40) EPHX1NAAAFKBP1ACYP19A1
SCHEMBL2681186 0.80 EPHX1 (0.44) EPHX1NAAACYP19A1
SCHEMBL18898078 0.79 EPHX1 (0.36) EPHX1NAAAFKBP1ACYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8574813-B2 Resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2013-11-05 US disclosed
US-20120225383-A1 RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2012-09-06 US disclosed
US-8192914-B2 Resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-06-05 US disclosed
US-7968269-B2 Positive resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-06-28 US disclosed
US-7964331-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-06-21 US disclosed
US-7939243-B2 Resin, resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-05-10 US disclosed
US-7914968-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-03-29 US disclosed
US-7910285-B2 Positive resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-03-22 US disclosed
US-7871753-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-18 US disclosed
US-20100304289-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-12-02 US disclosed
US-7776511-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-17 US disclosed
US-20100196823-A1 POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-05 US disclosed
US-20100159389-A1 RESIN, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-06-24 US disclosed
US-20090253075-A1 POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-10-08 US disclosed
US-20090162786-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-25 US disclosed
US-20090155713-A1 RESIST COMPOSITION AND PROCESS FOR PRODUCING SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-18 US disclosed
US-20090053650-A1 RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-26 US disclosed
US-7494762-B2 Positive resist composition for immersion lithography and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-24 US disclosed
US-20090042130-A1 POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO. LTD (JP) 2009-02-12 US disclosed
US-20080090171-A1 POSITIVE RESIST COMPOSITION FOR IMMERSION LITHOGRAPHY AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-17 US disclosed