SCHEMBL10087713

SCHEMBL10087713

CCC(C)(F)C(=O)OCOC1CCCCC1

nearest known ligand 0.36

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.36
NAAA Q02083 2/20 0.33
CYP19A1 P11511 1/20 0.33
PDK1 Q15118 1/20 0.31
PDK2 Q15119 1/20 0.31
PDK3 Q15120 1/20 0.31
PDK4 Q16654 1/20 0.31
ALDH1A1 P00352 1/20 0.30
MAPT P10636 1/20 0.30
FKBP1A P62942 2/20 0.30
GAA P10253 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10087711 1.00 EPHX1 (0.36) EPHX1NAAACYP19A1PDK1PDK2
SCHEMBL10087712 0.98 EPHX1 (0.33) EPHX1NAAACYP19A1FKBP1A
SCHEMBL824238 0.85 EPHX1 (0.34) EPHX1NAAACYP19A1PDK1PDK2
SCHEMBL824245 0.85 EPHX1 (0.34) EPHX1NAAACYP19A1PDK1PDK2
SCHEMBL47512 0.84 HMGCR (0.40) EPHX1NAAACYP19A1FKBP1A
SCHEMBL47408 0.84 HMGCR (0.40) EPHX1NAAACYP19A1FKBP1A
SCHEMBL824312 0.83 EPHX1 (0.32) EPHX1NAAAPDK1PDK2PDK3
SCHEMBL47524 0.82 HMGCR (0.40) EPHX1NAAACYP19A1FKBP1A
SCHEMBL18898078 0.81 EPHX1 (0.36) EPHX1NAAACYP19A1FKBP1A
SCHEMBL2680728 0.80 EPHX1 (0.47) EPHX1NAAACYP19A1PDK1PDK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8574813-B2 Resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2013-11-05 US disclosed
US-20120225383-A1 RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2012-09-06 US disclosed
US-8192914-B2 Resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-06-05 US disclosed
US-7968269-B2 Positive resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-06-28 US disclosed
US-7964331-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-06-21 US disclosed
US-7939243-B2 Resin, resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-05-10 US disclosed
US-7919227-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-04-05 US disclosed
US-7914968-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-03-29 US disclosed
US-7910285-B2 Positive resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-03-22 US disclosed
US-7871753-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-18 US disclosed
US-20100248133-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD (JP) 2010-09-30 US disclosed
US-7776511-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-17 US disclosed
US-20100196823-A1 POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-05 US disclosed
US-20100159389-A1 RESIN, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-06-24 US disclosed
US-20100040970-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-02-18 US disclosed
US-20090253075-A1 POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-10-08 US disclosed
US-20090162786-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-25 US disclosed
US-20090155713-A1 RESIST COMPOSITION AND PROCESS FOR PRODUCING SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-18 US disclosed
US-20090053650-A1 RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-26 US disclosed
US-20090042130-A1 POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO. LTD (JP) 2009-02-12 US disclosed