SCHEMBL10087714

SCHEMBL10087714

C=CC(=O)OC1C2CC3CC1CC(O)(C3)C2

nearest known ligand 0.40

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 17/20 0.40
HSD11B2 P80365 2/20 0.37
EPHX2 P34913 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10150666 0.82
SCHEMBL12932438 0.81 HSD11B1 (0.40) HSD11B1HSD11B2
SCHEMBL18826686 0.79 ATM (0.35) HSD11B1HSD11B2
SCHEMBL2636721 0.79 HSD11B1 (0.44) HSD11B1HSD11B2EPHX2
SCHEMBL12791827 0.79 HSD11B1 (0.44) HSD11B1HSD11B2EPHX2
SCHEMBL333419 0.78 HSD11B1 (0.46) HSD11B1EPHX2
SCHEMBL8099017 0.77 HSD11B1 (0.44) HSD11B1HSD11B2EPHX2
SCHEMBL3033655 0.77 HSD11B1 (0.42) HSD11B1HSD11B2EPHX2
SCHEMBL1592363 0.76 TSHR (0.33) HSD11B1
SCHEMBL3218526 0.75 HSD11B1 (0.41) HSD11B1HSD11B2EPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8378016-B2 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2013-02-19 US disclosed
US-8378016-B2 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2013-02-19 US disclosed
US-8192914-B2 Resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-06-05 US disclosed
US-8192914-B2 Resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-06-05 US disclosed
US-20110165519-A1 RESIN SUITABLE FOR AN ACID GENERATOR AND A CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION CONTAINING THE SAME ANDO NOBUO 2011-07-07 US disclosed
US-20110165519-A1 RESIN SUITABLE FOR AN ACID GENERATOR AND A CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION CONTAINING THE SAME ANDO NOBUO 2011-07-07 US disclosed
US-7638261-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-12-29 US disclosed
US-7638261-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-12-29 US disclosed
US-20090148790-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2009-06-11 US disclosed
US-20090148790-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2009-06-11 US disclosed
US-7510817-B2 Photoresist polymer compositions JSR CORPORATION (JP) 2009-03-31 US disclosed
US-7510817-B2 Photoresist polymer compositions JSR CORPORATION (JP) 2009-03-31 US disclosed
US-7250475-B2 Free radical addition polymerization of adamantyl (meth)acrylate derivates using a chain transfer agent comprising N-aminodithiocarbamate derivative; patterning semiconductor wafers; lithographic transfer of image from thin film of photosensitive resist material SYMYX TECHNOLOGIES, INC. (US) 2007-07-31 US disclosed
US-7250475-B2 Free radical addition polymerization of adamantyl (meth)acrylate derivates using a chain transfer agent comprising N-aminodithiocarbamate derivative; patterning semiconductor wafers; lithographic transfer of image from thin film of photosensitive resist material SYMYX TECHNOLOGIES, INC. (US) 2007-07-31 US disclosed
US-7163781-B2 Process for producing a semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 2007-01-16 US disclosed
US-7163781-B2 Process for producing a semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 2007-01-16 US disclosed