SCHEMBL10087731

SCHEMBL10087731

CCCCCCCOC(=O)CSc1c(F)c(F)c(S(=O)(=O)O)c(F)c1F

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.44
SMN1; SMN2 Q16637 2/20 0.43
FAAH O00519 2/20 0.41
RAD52 P43351 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
CA12 O43570 2/20 0.38
CA1 P00915 2/20 0.38
CA2 P00918 2/20 0.38
CA7 P43166 2/20 0.38
CA13 Q8N1Q1 2/20 0.38
CA9 Q16790 1/20 0.38
MEN1 O00255 1/20 0.38
CYP1A2 P05177 1/20 0.38
CYP3A4 P08684 1/20 0.38
CYP2C9 P11712 1/20 0.38
CYP2C19 P33261 1/20 0.38
KMT2A Q03164 1/20 0.38
ESR1 P03372 1/20 0.38
HTR2C P28335 1/20 0.38
DGKA P23743 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12172747 0.79 CA2 (0.53) CA12CA1CA2CA7CA13
SCHEMBL16313656 0.79 CA2 (0.53) CA12CA1CA2CA7CA13
SCHEMBL10172873 0.79 CA2 (0.53) CA12CA1CA2CA7CA13
SCHEMBL112773 0.79 CA2 (0.53) CA12CA1CA2CA7CA13
SCHEMBL2611770 0.79 CA2 (0.53) CA12CA1CA2CA7CA13
SCHEMBL12689958 0.79 CA2 (0.53) CA12CA1CA2CA7CA13
SCHEMBL14353367 0.73 NAAA (0.67) NAAASMN1; SMN2FAAHRAD52NPSR1
SCHEMBL14353318 0.73 NAAA (0.67) NAAASMN1; SMN2FAAHRAD52NPSR1
SCHEMBL19812459 0.73 NAAA (0.67) NAAASMN1; SMN2FAAHRAD52NPSR1
SCHEMBL19812438 0.73 NAAA (0.67) NAAASMN1; SMN2FAAHRAD52NPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170059992-A1 RESIST PATTERN-FORMING METHOD AND CHEMICALLY AMPLIFIED RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2017-03-02 US disclosed
US-20170059992-A1 RESIST PATTERN-FORMING METHOD AND CHEMICALLY AMPLIFIED RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2017-03-02 US disclosed
US-9046782-B2 Resist composition for negative tone development and pattern forming method using the same FUJIFILM CORPORATION (JP) 2015-06-02 US disclosed
US-9046782-B2 Resist composition for negative tone development and pattern forming method using the same FUJIFILM CORPORATION (JP) 2015-06-02 US disclosed
EP-2353048-B1 PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD FUJIFILM CORP (JP) 2015-02-25 EP disclosed
US-8709704-B2 Pattern forming method using developer containing organic solvent and rinsing solution for use in the pattern forming method FUJIFILM CORPORATION (JP) 2014-04-29 US disclosed
US-8709704-B2 Pattern forming method using developer containing organic solvent and rinsing solution for use in the pattern forming method FUJIFILM CORPORATION (JP) 2014-04-29 US disclosed
US-8343708-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2013-01-01 US disclosed
US-8343708-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2013-01-01 US disclosed
US-20120034564-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2012-02-09 US disclosed
US-20100112477-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-20100112477-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-7666574-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2010-02-23 US disclosed
US-7666574-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2010-02-23 US disclosed
US-7635554-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2009-12-22 US disclosed
US-7635554-B2 Positive resist composition and pattern forming method FUJIFILM CORPORATION (JP) 2009-12-22 US disclosed
US-20080248421-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2008-10-09 US disclosed
US-20080248421-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2008-10-09 US disclosed
US-20080241746-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2008-10-02 US disclosed
US-20080241746-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2008-10-02 US disclosed