SCHEMBL10197453

SCHEMBL10197453

NCCCC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14148257 0.92
SCHEMBL28970288 0.89 ALDH1A1 (0.58)
SCHEMBL11587178 0.89
SCHEMBL16888378 0.89 ALDH1A1 (0.58)
SCHEMBL9181110 0.89 ALDH1A1 (0.58)
Diaminooctane SCHEMBL9259792 0.89 ALDH1A1 (0.58)
SCHEMBL10197447 0.81
SCHEMBL4453321 0.81 CHRM2 (0.44)
SCHEMBL21339838 0.81 TSHR (0.46)
SCHEMBL7520650 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116444196-B Composite water reducing agent and application thereof 北京鼎瀚中航建设有限公司 2023-08-22 CN claimed
CN-116355106-B Preparation method of starch-based water reducer 北京慕湖外加剂有限公司 2023-08-08 CN claimed
CN-116444196-A Composite water reducing agent and application thereof 北京鼎瀚中航建设有限公司 2023-07-18 CN claimed
CN-116355106-A Preparation method of starch-based water reducer 北京慕湖外加剂有限公司 2023-06-30 CN claimed
CN-113038934-A Modulation of hydrogel release kinetics 里珍纳龙药品有限公司 2021-06-25 CN claimed
US-10672678-B2 Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package INFINEON TECHNOLOGIES AG (DE) 2020-06-02 US claimed
US-10497634-B2 Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound INFINEON TECHNOLOGIES AG (DE) 2019-12-03 US claimed
US-20190287875-A1 METHODS FOR FORMING A CHIP PACKAGE INFINEON TECHNOLOGIES AG (DE) 2019-09-19 US claimed
US-20170338165-A1 CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE INFINEON TECHNOLOGIES AG (DE) 2017-11-23 US claimed
CN-116444196-B Composite water reducing agent and application thereof 北京鼎瀚中航建设有限公司 2023-08-22 CN disclosed
CN-116355106-B Preparation method of starch-based water reducer 北京慕湖外加剂有限公司 2023-08-08 CN disclosed
CN-116444196-A Composite water reducing agent and application thereof 北京鼎瀚中航建设有限公司 2023-07-18 CN disclosed
CN-116355106-A Preparation method of starch-based water reducer 北京慕湖外加剂有限公司 2023-06-30 CN disclosed
US-10672678-B2 Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package INFINEON TECHNOLOGIES AG (DE) 2020-06-02 US disclosed
WO-2010132839-A2 AMINOGLYCOSIDE DOSING REGIMENS ACHAOGEN, INC. (US) 2010-11-18 WO disclosed
WO-2010132760-A1 ANTIBACTERIAL DERIVATIVES OF TOBRAMYCIN ACHAOGEN, INC. (US) 2010-11-18 WO disclosed
US-4927902-A REACTION PRODUCT OF HYDROGEN SULFIDE OR ORGANIC DITHIOLS WITH POLYGLYCIDYL SUBSTITUTED AMINES HENKEL CORPORATION (US) 1990-05-22 US disclosed
US-4879414-A POLYGLYCIDYL SUBSTITUTED AMINES AND HYDROGEN SULFIDE OR DITHIOL HENKEL CORPORATION (US) 1989-11-07 US disclosed
EP-0329093-A2 Polythiols and use as epoxy resin curing agents HENKEL CORPORATION (a Delaware corp.) (US) 1989-08-23 EP disclosed
US-4100149-A ION EXCHANGE RESIN CONSISTING OF INORGANIC CARRIER COATED WITH CROSS-LINKED POLYMER CONTAINING TERTIARY AMINES OR SALTS OF QUATERNARY AMMONIUM RHONE-POULENC INDUSTRIES (FR) 1978-07-11 US disclosed