SCHEMBL1023934

SCHEMBL1023934

C=CC(=O)Sc1ccc(Sc2ccc(SC(=O)C=C)cc2)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 2/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
LMNA P02545 1/20 0.41
NR1H2 P55055 1/20 0.39
ALDH1A1 P00352 1/20 0.36
NPC1 O15118 1/20 0.34
MITF O75030 1/20 0.34
XBP1 P17861 1/20 0.34
RAB9A P51151 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
NOD2 Q9HC29 1/20 0.34
CYP3A4 P08684 1/20 0.33
TSHR P16473 1/20 0.33
MAPK1 P28482 1/20 0.33
AKT1 P31749 1/20 0.32
CTRC Q99895 1/20 0.32
ALDH5A1 P51649 1/20 0.31
ABAT P80404 1/20 0.31
ADRA2A P08913 1/20 0.31
ADRA2B P18089 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid SCHEMBL27803989 0.94 LMNA (0.40) HPGDL3MBTL1LMNANR1H2ALDH1A1
SCHEMBL4857114 0.93 AKT1 (0.36) HPGDL3MBTL1LMNAALDH1A1NPC1
SCHEMBL27460819 0.90 ALDH1A1 (0.39) HPGDL3MBTL1LMNAALDH1A1NPC1
SCHEMBL16170352 0.86 AKT1 (0.32) L3MBTL1AKT1ALDH5A1ABATMAPT
SCHEMBL16170754 0.86 AKT1 (0.32) L3MBTL1AKT1ALDH5A1ABATMAPT
SCHEMBL16170477 0.86 AKT1 (0.32) L3MBTL1AKT1ALDH5A1ABATMAPT
SCHEMBL25119629 0.84 LMNA (0.32) HPGDL3MBTL1LMNA
SCHEMBL16170456 0.83 PTPN1 (0.37) LMNAALDH1A1NPC1RAB9AKDM4E
SCHEMBL16170454 0.83 SRD5A2 (0.44) HPGDL3MBTL1LMNAALDH1A1MAPK1
SCHEMBL330818 0.82 AKT1 (0.46) HPGDLMNAALDH1A1NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 128 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112912192-B Composition containing metal particles and conductive adhesive film 古河电气工业株式会社 2023-03-21 CN claimed
US-11466181-B2 Metal particle-containing composition and electrically conductive adhesive film FURUKAWA ELECTRIC CO., LTD. (JP) 2022-10-11 US claimed
EP-3415579-B1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND DICING/DIE-BONDING FILM USING SAME FURUKAWA ELECTRIC CO LTD (JP) 2022-07-20 EP claimed
US-11230649-B2 Electrically conductive adhesive film and dicing-die bonding film using the same FURUKAWA ELECTRIC CO., LTD. (JP) 2022-01-25 US claimed
EP-3939719-A1 METAL PARTICLE-CONTAINING COMPOSITION, AND CONDUCTIVE ADHESIVE FILM FURUKAWA ELECTRIC CO., LTD. (JP) 2022-01-19 EP claimed
US-20210317343-A1 METAL PARTICLE-CONTAINING COMPOSITION AND ELECTRICALLY CONDUCTIVE ADHESIVE FILM FURUKAWA ELECTRIC CO., LTD. (JP) 2021-10-14 US claimed
CN-112912192-A Composition containing metal particles and conductive adhesive film 古河电气工业株式会社 2021-06-04 CN claimed
WO-2020189359-A1 METAL PARTICLE-CONTAINING COMPOSITION, AND CONDUCTIVE ADHESIVE FILM 古河電気工業株式会社 2020-09-24 WO claimed
EP-3415579-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND DICING/DIE-BONDING FILM USING SAME Furukawa Electric Co., Ltd. (JP) 2018-12-19 EP claimed
US-20180346767-A1 ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME FURUKAWA ELECTRIC CO., LTD. (JP) 2018-12-06 US claimed
US-12523930-B2 Nanoimprint composition and pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2026-01-13 US disclosed
WO-2025070623-A1 BONDING FILM, SEMICONDUCTOR MODULE, INVERTER, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE 古河電気工業株式会社 2025-04-03 WO disclosed
WO-2025028353-A1 NOVEL HETEROCYCLIC RING-CONTAINING MONOMER エア・ウォーター・パフォーマンスケミカル株式会社 2025-02-06 WO disclosed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-6241625-B1 A GOLF BALL COMPRISING A COVER MEMBER AND A CORE MEMBER, WHEREIN POLYAMIDE, TERPOLYMER IONOMER CONTAINING ETHYLENE, (METH)ACRYLIC ACID, AND (METH)ACRYLIC ESTER MIXTURES WITH PEROXIDE AND SULFIDE SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2001-06-05 US disclosed
US-6206550-B1 BACKLIGHT WITH LENS PORTION MADE FROM A CURABLE COMPOSITION WHICH INCLUDES A BIS(4-(METH)ACRYLOYL-THIOPHENYL) SULFIDE AND (METH)ACRYLATES; HIGH BRIGHTNESS-ENHANCING EFFECT ON LENSES OF PROJECTION TVS AND STEREOSCOPIC PHOTOGRAPHY. MITSUBISHI RAYON COMPANY LTD. (JP) 2001-03-27 US disclosed
EP-0952466-A2 Lens sheet MITSUBISHI RAYON CO., LTD. (JP) 1999-10-27 EP disclosed
US-5969867-A ACRYLIC ESTERS MITSUBISHI RAYON COMPANY LTD. (JP) 1999-10-19 US disclosed
EP-0735062-A1 ACTINIC-RADIATION-CURABLE COMPOSITION AND LENS SHEET MITSUBISHI RAYON CO., LTD. (JP) 1996-10-02 EP disclosed