Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MMP8 | P22894 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14838468 | 1.00 | MMP8 (0.33) | MMP8 | |
| SCHEMBL18698633 | 0.98 | MMP8 (0.33) | MMP8 | |
| SCHEMBL13759975 | 0.98 | MMP8 (0.33) | MMP8 | |
| SCHEMBL19901670 | 0.88 | — | — | |
| SCHEMBL23366125 | 0.87 | MMP8 (0.31) | MMP8 | |
| SCHEMBL18711195 | 0.87 | MMP8 (0.31) | MMP8 | |
| SCHEMBL12296066 | 0.86 | — | — | |
| SCHEMBL15326153 | 0.86 | MMP8 (0.34) | MMP8 | |
| SCHEMBL24262255 | 0.86 | MMP8 (0.34) | MMP8 | |
| SCHEMBL15203370 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12032290-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2024-07-09 | — | — | US | disclosed |
| US-20230135117-A1 | SOLUTION, SOLUTION STORAGE BODY, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2023-05-04 | — | — | US | disclosed |
| US-11584810-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, method of manufacturing electronic device, compound, and resin | FUJIFILM CORPORATION (JP) | 2023-02-21 | — | — | US | disclosed |
| US-11573489-B2 | Solution, solution storage body, actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and manufacturing method of semiconductor device | FUJIFILM CORPORATION (JP) | 2023-02-07 | — | — | US | disclosed |
| US-20220187706-A1 | THIN FILM RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST FILM USING THE SAME | MERCK PATENT GMBH (DE) | 2022-06-16 | — | — | US | disclosed |
| US-20210318616-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2021-10-14 | — | — | US | disclosed |
| US-20210181633-A1 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-06-17 | — | — | US | disclosed |
| US-10599038-B2 | Rinsing liquid, pattern forming method, and electronic device manufacturing method | FUJIFILM CORPORATION (JP) | 2020-03-24 | — | — | US | disclosed |
| US-20190196327-A1 | SOLUTION, SOLUTION STORAGE BODY, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2019-06-27 | — | — | US | disclosed |
| US-10246605-B2 | Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device | FUJIFILM CORPORATION (JP) | 2019-04-02 | — | — | US | disclosed |
| US-9996003-B2 | Active-light-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2018-06-12 | — | — | US | disclosed |
| US-9897922-B2 | Method of forming pattern and developer for use in the method | FUJIFILM CORPORATION (JP) | 2018-02-20 | — | — | US | disclosed |
| US-20170158905-A1 | RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, IMPRINT FORMING KIT, AND PROCESS FOR PRODUCING DEVICE | FUJIFILM CORPORATION (JP) | 2017-06-08 | — | — | US | disclosed |
| US-20170115568-A1 | ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2017-04-27 | — | — | US | disclosed |
| EP-2141544-B1 | Photosensitive composition and pattern forming method using same | FUJIFILM CORP (JP) | 2017-04-12 | — | — | EP | disclosed |
| WO-2012043866-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM AND METHOD OF FORMING PATTERN | FUJIFILM CORPORATION (JP) | 2012-04-05 | — | — | WO | disclosed |
| WO-2010147228-A1 | PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2010-12-23 | — | — | WO | disclosed |