SCHEMBL10275064

SCHEMBL10275064

CCO[Si](OCC)(OCC)C(CC)NC(C)NCc1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
SIGMAR1 Q99720 3/20 0.41
POLB P06746 1/20 0.37
MEN1 O00255 3/20 0.37
KMT2A Q03164 3/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
CASR P41180 1/20 0.36
NPSR1 Q6W5P4 1/20 0.35
BCHE P06276 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.34
THRB P10828 1/20 0.33
IDO1 P14902 1/20 0.33
ANPEP P15144 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL144037 0.87 SIGMAR1 (0.42) SIGMAR1POLBMEN1KMT2AL3MBTL1
Hydrochloric Acid SCHEMBL8927852 0.86 SIGMAR1 (0.41) SIGMAR1POLBMEN1KMT2AL3MBTL1
SCHEMBL10938990 0.72 SIGMAR1 (0.49) SIGMAR1POLBSMN1; SMN2THRBIDO1
SCHEMBL1116631 0.72 SIGMAR1 (0.44) SIGMAR1POLBMEN1KMT2AL3MBTL1
SCHEMBL3413593 0.72 SIGMAR1 (0.65) SIGMAR1POLBMEN1KMT2ACASR
SCHEMBL16714856 0.72 SIGMAR1 (0.53) SIGMAR1POLBMEN1KMT2AL3MBTL1
SCHEMBL138740 0.70 TDP1 (0.41) MEN1KMT2AL3MBTL1NPSR1SMN1; SMN2
SCHEMBL16714867 0.70 SIGMAR1 (0.54) SIGMAR1POLBMEN1KMT2AL3MBTL1
SCHEMBL57189 0.70
SCHEMBL10939504 0.70 SIGMAR1 (0.53) SIGMAR1POLBMEN1KMT2ACASR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12261143-B2 Method of manufacturing substrate layered body and layered body MITSUI CHEMICALS, INC. (JP) 2025-03-25 US disclosed
WO-2025023139-A1 LAMINATE AND LAMINATE PRODUCTION METHOD 三井化学株式会社 2025-01-30 WO disclosed
WO-2025005084-A1 SUBSTRATE LAMINATE 三井化学株式会社 2025-01-02 WO disclosed
WO-2024225232-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME 三井化学株式会社 2024-10-31 WO disclosed
WO-2024177116-A1 PRODUCTION METHOD FOR SEMICONDUCTOR CHIP WITH RESIN LAYER AND PRODUCTION METHOD FOR SUBSTRATE LAMINATE 三井化学株式会社 2024-08-29 WO disclosed
WO-2024177149-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME 三井化学株式会社 2024-08-29 WO disclosed
WO-2024177074-A1 METHOD FOR MANUFACTURING SUBSTRATE LAMINATE 三井化学株式会社 2024-08-29 WO disclosed
WO-2024172044-A1 METHOD FOR MANUFACTURING SUBSTRATE LAYERED BODY, LAYERED BODY, AND SUBSTRATE LAYERED BODY 三井化学株式会社 2024-08-22 WO disclosed
WO-2024166789-A1 SEMICONDUCTOR STRUCTURE AND PRODUCTION METHOD FOR SAME 三井化学株式会社 2024-08-15 WO disclosed
WO-2024162446-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME 三井化学株式会社 2024-08-08 WO disclosed
WO-2020235420-A1 METHOD FOR PRODUCING LIGHT EMITTING PARTICLES, LIGHT EMITTING PARTICLES, LIGHT EMITTING PARTICLE DISPERSION, INK COMPOSITION AND LIGHT EMITTING ELEMENT DIC株式会社 (JP) 2020-11-26 WO disclosed
US-20200347265-A1 SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR PROCESSING MATERIAL, AND SEMICONDUCTOR DEVICE MITSUI CHEMICALS, INC. (JP) 2020-11-05 US disclosed
EP-3379565-B1 SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING PROCESSING MATERIAL FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE MITSUI CHEMICALS INC (JP) 2020-10-14 EP disclosed
US-10752805-B2 Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device MITSUI CHEMICALS, INC. (JP) 2020-08-25 US disclosed
EP-3616903-A1 SUBSTRATE LAMINATE AND METHOD FOR MANUFACTURING SUBSTRATE LAMINATE Mitsui Chemicals, Inc. (JP) 2020-03-04 EP disclosed
US-20200048515-A1 SUBSTRATE LAMINATED BODY AND METHOD OF MANUFACTURING SUBSTRATE LAMINATED BODY MITSUI CHEMICALS, INC. (JP) 2020-02-13 US disclosed
CN-110545997-A Substrate laminate and method for manufacturing substrate laminate MITSUI CHEMICALS INC 2019-12-06 CN disclosed
US-20180334588-A1 SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR PROCESSING MATERIAL, AND SEMICONDUCTOR DEVICE MITSUI CHEMICALS, INC. (JP) 2018-11-22 US disclosed
EP-3379565-A1 SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING PROCESSING MATERIAL FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE Mitsui Chemicals, Inc. (JP) 2018-09-26 EP disclosed
US-20120177911-A1 PREPREG ASAHI KASEI E-MATERIALS CORPORATION (JP) 2012-07-12 US disclosed