SCHEMBL10277563

SCHEMBL10277563

CO[Si](CCCOC(=O)CCC(=O)O)(OC)OC

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.38
ADRA2A P08913 1/20 0.38
ADRA1A P35348 1/20 0.38
EGLN1 Q9GZT9 2/20 0.37
ALDH1A1 P00352 2/20 0.37
MAPT P10636 1/20 0.37
BLM P54132 1/20 0.37
KDM6B O15054 1/20 0.37
KDM5C P41229 1/20 0.37
PHF8 Q9UPP1 1/20 0.37
KDM2A Q9Y2K7 1/20 0.37
HTR2C P28335 1/20 0.37
NPC1 O15118 1/20 0.36
DGKA P23743 1/20 0.36
LMNA P02545 3/20 0.35
PAM P19021 2/20 0.33
NAAA Q02083 1/20 0.32
GSTP1 P09211 1/20 0.32
GSTM2 P28161 1/20 0.32
ALKBH5 Q6P6C2 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5164186 0.93 ADRA2A (0.43) TSHRADRA2AADRA1AMAPTBLM
SCHEMBL31104907 0.89 ADRA2A (0.41) TSHRADRA2AADRA1AEGLN1ALDH1A1
SCHEMBL5159381 0.87 DGKA (0.48) TSHRADRA2AADRA1AALDH1A1MAPT
SCHEMBL29028474 0.85 HTR2C (0.46) TSHRADRA2AADRA1AALDH1A1MAPT
SCHEMBL29028405 0.85 HTR2C (0.46) TSHRADRA2AADRA1AALDH1A1MAPT
SCHEMBL28059389 0.84 TSHR (0.36) TSHRADRA2AADRA1AEGLN1ALDH1A1
SCHEMBL15617665 0.84 NPC1 (0.41) TSHRADRA2AADRA1AEGLN1ALDH1A1
SCHEMBL6271674 0.84 DGKA (0.46) ADRA2AADRA1AALDH1A1MAPTBLM
SCHEMBL30684532 0.83 NPC1 (0.38) TSHRADRA2AADRA1AEGLN1ALDH1A1
SCHEMBL176416 0.83 HTR2C (0.38) TSHRADRA2AADRA1AEGLN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024241809-A1 ADHESIVE COMPOSITION, ADHESIVE, ADHESIVE SHEET, AND OPTICAL MEMBER WITH ADHESIVE LAYER リンテック株式会社 2024-11-28 WO disclosed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
WO-2023048062-A1 SILOXANE RESIN COMPOSITION FOR FORMING CURED FILM, CURED FILM, AND METHOD FOR PRODUCING POLYSILOXANE 東レ株式会社 2023-03-30 WO disclosed
WO-2021006237-A1 ANTIFOULING COATING COMPOSITION AND COATED ARTICLE HAVING AT SURFACE THEREOF ANTIFOULING COATING FILM FORMED USING SAID COMPOSITION 日東化成株式会社 2021-01-14 WO disclosed
EP-3018532-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED BY CURING SAME, AND USE OF THE FILM IN AN OPTICAL DEVICE TORAY INDUSTRIES (JP) 2020-08-19 EP disclosed
EP-3098653-B1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED BY CURING SAME, METHOD FOR PRODUCING CURED FILM, OPTICAL DEVICE PROVIDED WITH CURED FILM, AND BACKSIDE-ILLUMINATED CMOS IMAGE SENSOR TORAY INDUSTRIES (JP) 2020-07-29 EP disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
CN-106415393-B Negative photosensitive resin composition, cured film obtained by curing the same, method for producing the same, optical device having the same, and back-illuminated CMOS image sensor 东丽株式会社 2020-04-07 CN disclosed
EP-2485091-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED USING SAME, AND OPTICAL DEVICE TORAY INDUSTRIES (JP) 2020-02-12 EP disclosed
WO-2019176785-A1 NEGATIVE PHOTOSENSITIVE COLORING COMPOSITION, CURED FILM, AND TOUCH PANEL USING SAME 東レ株式会社 2019-09-19 WO disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
US-20170010532-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED BY CURING SAME, METHOD FOR PRODUCING CURED FILM, OPTICAL DEVICE PROVIDED WITH CURED FILM, AND BACKSIDE-ILLUMINATED CMOS IMAGE SENSOR TORAY INDUSTRIES, INC. (JP) 2017-01-12 US disclosed
US-20160370703-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED BY CURING SAME, AND OPTICAL DEVICE EQUIPPED WITH SAME TORAY INDUSTRIES, INC. (JP) 2016-12-22 US disclosed
EP-3098653-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED BY CURING SAME, METHOD FOR PRODUCING CURED FILM, OPTICAL DEVICE PROVIDED WITH CURED FILM, AND BACKSIDE-ILLUMINATED CMOS IMAGE SENSOR Toray Industries, Inc. (JP) 2016-11-30 EP disclosed
US-9430071-B2 Resin composition, and transparent membrane for touch panel sensors and touch panel using same DNP FINE CHEMICALS CO., LTD. (JP) 2016-08-30 US disclosed
EP-3018532-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED BY CURING SAME, AND OPTICAL DEVICE EQUIPPED WITH SAME Toray Industries, Inc. (JP) 2016-05-11 EP disclosed
US-20150116234-A1 RESIN COMPOSITION, AND TRANSPARENT MEMBRANE FOR TOUCH PANEL SENSORS AND TOUCH PANEL USING SAME DNP FINE CHEMICALS CO., LTD. (JP) 2015-04-30 US disclosed
US-8828642-B2 Positive photosensitive resin composition, cured film obtained using same, and optical device TORAY INDUSTRIES, INC. (JP) 2014-09-09 US disclosed
EP-2485091-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED USING SAME, AND OPTICAL DEVICE Toray Industries, Inc. (JP) 2012-08-08 EP disclosed
US-20120178022-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED USING SAME, AND OPTICAL DEVICE TORAY INDUSTRIES, INC. (JP) 2012-07-12 US disclosed