SCHEMBL1035786

SCHEMBL1035786

COCCOCOCCOC

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28144 0.96 CA2 (0.34) CA2
SCHEMBL14754921 0.96 CA2 (0.39) CA2
SCHEMBL8766921 0.96 CA2 (0.39) CA2
SCHEMBL11699014 0.96 CA2 (0.39) CA2
Hydrochloric Acid SCHEMBL25282182 0.93 CA2 (0.33) CA2
SCHEMBL5847044 0.89
SCHEMBL4957828 0.87
SCHEMBL9854665 0.87 ALDH1A1 (0.32) CA2
SCHEMBL28355209 0.87 ALDH1A1 (0.41) CA2
SCHEMBL10743750 0.86 CA2 (0.33) CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 463 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4743506-A1 LARGE AREA BONDING ADHESIVE Novatech International NV (BE) 2026-05-20 EP claimed
WO-2025235712-A1 ALTERNATIVE SOLVENT BLENDS FOR USE IN FORMING AND APPLYING THERMOSETTING POLYAMIDE-IMIDE ESSEX SOLUTIONS USA LLC (US) 2025-11-13 WO claimed
US-20250297194-A1 CLEANING METHOD OF SEMICONDUCTOR DEVICE, CLEANING APPARATUS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CLEANING COMPOSITION DAXIN MATERIALS CORPORATION (TW) 2025-09-25 US claimed
EP-4621829-A1 CLEANING METHOD OF SEMICONDUCTOR DEVICE, CLEANING APPARATUS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CLEANING COMPOSITION Daxin Materials Corporation (TW) 2025-09-24 EP claimed
CN-119683583-B Preparation method of nanoscale sulfide solid electrolyte 合肥国轩高科动力能源有限公司 2025-05-23 CN claimed
EP-4549327-A1 PROTECTIVE COATING FOR HOT-MELT PRESSURE SENSITIVE ADHESIVES Sika Technology AG (CH) 2025-05-07 EP claimed
US-12292689-B2 Alkaline cleaning composition, cleaning method, and manufacturing method of semiconductor DAXIN MATERIALS CORPORATION (TW) 2025-05-06 US claimed
CN-119683583-A Preparation method of nanoscale sulfide solid electrolyte 合肥国轩高科动力能源有限公司 2025-03-25 CN claimed
WO-2025016940-A1 LARGE AREA BONDING ADHESIVE Novatech International NV (BE) 2025-01-23 WO claimed
CN-119170781-A Preparation method of sulfur-based composite material with self-repairing function layer coating 安徽通能新能源科技有限公司 2024-12-20 CN claimed
EP-3265500-B1 WATER BASED PRIMER COMPOSITION FULLER H B CO (US) 2019-01-30 EP claimed
US-20180371261-A1 NON-HAZARDOUS WATER-BASED POLYURETHANE DISPERSION SIKA TECHNOLOGY AG (CH) 2018-12-27 US claimed
EP-3394143-A1 NON-HAZARDOUS WATER-BASED POLYURETHANE DISPERSION Sika Technology AG (CH) 2018-10-31 EP claimed
EP-3265510-A1 SOLVENT BASED PRIMER COMPOSITION H. B. Fuller Company (US) 2018-01-10 EP claimed
EP-3265500-A1 WATER BASED PRIMER COMPOSITION H. B. Fuller Company (US) 2018-01-10 EP claimed
EP-2864429-B1 INK COMPOSITION OCE TECH BV (NL) 2017-08-30 EP claimed
WO-2017108872-A1 NON-HAZARDOUS WATER-BASED POLYURETHANE DISPERSION SIKA TECHNOLOGY AG (CH) 2017-06-29 WO claimed
WO-2016144753-A1 WATER BASED PRIMER COMPOSITION H.B. FULLER COMPANY (US) 2016-09-15 WO claimed
WO-2016144756-A1 SOLVENT BASED PRIMER COMPOSITION H.B. FULLER COMPANY (US) 2016-09-15 WO claimed
US-4225706-A Polychalcogen ester of cephem compound, process for preparing the same and method for removing the protective group of the same MEIJI SEIKA KAISHA LTD. (JP) 1980-09-30 US claimed