SCHEMBL1053222

SCHEMBL1053222

FC(F)(F)C[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Boric Acid SCHEMBL31258782 0.83 LMNA (0.31)
SCHEMBL31173118 0.83
Boric Acid SCHEMBL31172975 0.83 LMNA (0.31)
Phosphoric Acid SCHEMBL31173015 0.78 PGK1 (0.36)
SCHEMBL852287 0.67
Norflurane SCHEMBL11036325 0.59
Norflurane SCHEMBL5466910 0.59
Norflurane SCHEMBL1173735 0.59
SCHEMBL25287 0.59
SCHEMBL166134 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024217291-A1 SECONDARY BATTERY AND PREPARATION METHOD THEREFOR AND ELECTRIC DEVICE 华为技术有限公司 2024-10-24 WO claimed
CN-118725484-A Nanoparticle grafted fluorosilane coupling agent compatibilized fluorine/silicon rubber and preparation method thereof 超能材料科技(大连)有限公司 2024-10-01 CN claimed
EP-2011834-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2012-07-25 EP claimed
US-12418046-B2 Nonaqueous electrolyte solution MITSUBISHI CHEMICAL CORPORATION (JP) 2025-09-16 US disclosed
US-20250260058-A1 NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS-ELECTROLYTIC-SOLUTION BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2025-08-14 US disclosed
WO-2024217291-A1 SECONDARY BATTERY AND PREPARATION METHOD THEREFOR AND ELECTRIC DEVICE 华为技术有限公司 2024-10-24 WO disclosed
CN-118725484-A Nanoparticle grafted fluorosilane coupling agent compatibilized fluorine/silicon rubber and preparation method thereof 超能材料科技(大连)有限公司 2024-10-01 CN disclosed
CN-118048095-A Preparation process of solvent-free epoxy composite coating 江西百盛精细化学品有限公司 2024-05-17 CN disclosed
CN-114207901-B Nonaqueous electrolyte solution and nonaqueous electrolyte battery 三菱化学株式会社 2024-04-09 CN disclosed
EP-4175001-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQUEOUS ELECTROLYTIC SOLUTION BATTERY Mitsubishi Chemical Corporation (JP) 2023-05-03 EP disclosed
US-20230125746-A1 Nonaqueous Electrolytic Solution and Nonaqueous Electrolytic Solution Battery MITSUBISHI CHEMICAL CORPORATION (JP) 2023-04-27 US disclosed
CN-101426859-A Curable composition KANEGAFUCHI CHEMICAL IND (JP) 2009-05-06 CN disclosed
US-20090069505-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-03-12 US disclosed
EP-2011834-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2009-01-07 EP disclosed
EP-1931613-A2 ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES FujiFilm Electronic Materials USA, Inc. (US) 2008-06-18 EP disclosed
EP-1931746-A2 ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES FujiFilm Electronic Materials USA, Inc. (US) 2008-06-18 EP disclosed
WO-2007033075-A2 ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2007-03-22 WO disclosed
WO-2007033123-A2 ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2007-03-22 WO disclosed
US-20070057235-A1 Additives to prevent degradation of cyclic alkene derivatives FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2007-03-15 US disclosed
US-20070057234-A1 Additives to prevent degradation of cyclic alkene derivatives FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2007-03-15 US disclosed