SCHEMBL1055347

SCHEMBL1055347

C=CCc1cc(C(c2ccc(O)c(CC=C)c2)(C(F)(F)F)C(F)(F)F)ccc1O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 6/20 0.56
GABRB2 P47870 6/20 0.56
POLB P06746 2/20 0.49
MEN1 O00255 2/20 0.45
GAA P10253 2/20 0.45
MAPT P10636 2/20 0.45
CNR1 P21554 2/20 0.45
CNR2 P34972 2/20 0.45
KMT2A Q03164 2/20 0.45
ALOX5 P09917 1/20 0.45
GABRB1 P18505 1/20 0.45
RXRA P19793 1/20 0.45
GABRA5 P31644 1/20 0.45
GABRA3 P34903 1/20 0.45
GABRA2 P47869 1/20 0.45
ACE2 Q9BYF1 1/20 0.45
SIRT3 Q9NTG7 1/20 0.45
AKR1B1 P15121 2/20 0.44
ESR1 P03372 3/20 0.41
ESR2 Q92731 3/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29414940 1.00 GABRA1 (0.56) GABRA1GABRB2POLBMEN1GAA
SCHEMBL29463283 1.00 GABRA1 (0.56) GABRA1GABRB2POLBMEN1GAA
SCHEMBL2300766 0.94 ESR1 (0.53) GABRA1GABRB2POLBMEN1GAA
2-Allylphenol SCHEMBL22207670 0.93 GABRA1 (0.49) GABRA1GABRB2POLBMEN1GAA
SCHEMBL1400362 0.86 GABRA1 (0.59) GABRA1GABRB2POLBMEN1GAA
SCHEMBL7608902 0.84 ESR1 (0.36) GABRA1GABRB2POLBESR1ESR2
Formic Acid SCHEMBL15743052 0.84 GABRA1 (0.53) GABRA1GABRB2POLBMEN1GAA
SCHEMBL28417627 0.84 GABRA1 (0.53) GABRA1GABRB2POLBMEN1GAA
SCHEMBL10039388 0.83 GABRA1 (0.36) GABRA1GABRB2POLBGAAALOX5
SCHEMBL14626464 0.83 GABRA1 (0.40) GABRA1GABRB2POLBMEN1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6991887-B1 Photopatternable sorbent and functionalized films BATTELLE MEMORIAL INSTITUTE (US) 2006-01-31 US claimed
US-6015869-A SORBENT COPOLYMERS(OR OLIGOMERS) CONTAINING ALKYL-SUBSTITUTED FLUORINATED BISPHENOL MONOMERS ALTERNATING WITH SILOXANE MONOMERS, FOR SENSITIVE THIN FILMS ON SENSORS OR CLADDING ON OPTICAL FIBERS BATTELLE MEMORIAL INSTITUTE (US) 2000-01-18 US claimed
EP-0372775-B1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS (JP) 1994-05-18 EP claimed
US-4968762-A IMPACT STRENGTH, TOUGHNESS, LOW WATER ABSORPTION MITSUI TOATSU CHEMICALS, INC. (JP) 1990-11-06 US claimed
EP-0372775-A1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-13 EP claimed
US-20240369930-A1 COMPOSITION FOR SPIN-ON CARBON FILM FORMATION, METHOD FOR PRODUCING COMPOSITION FOR SPIN-ON CARBON FILM FORMATION, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMATION METHOD, AND CIRCUIT PATTERN FORMATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-11-07 US disclosed
WO-2024107818-A1 BIS-TRIFLUOROMETHYL HONOKIOL ANALOGS AND THEIR USE IN TREATING CARDIOVASCULAR DISORDERS VANDERBILT UNIVERSITY (US) 2024-05-23 WO disclosed
US-20240117101-A1 COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, COMPOSITION FOR OPTICAL MEMBER FORMATION, RESIN FOR UNDERLAYER FILM FORMATION, RESIST RESIN, RADIATION-SENSITIVE RESIN, AND RESIN FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-04-11 US disclosed
US-20230314942-A1 POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION, METHOD FOR PRODUCING POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-05 US disclosed
US-20230296982-A1 POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-09-21 US disclosed
WO-2023032998-A1 SPIN-ON-CARBON FILM-FORMING COMPOSITION, METHOD FOR PRODUCING SPIN-ON-CARBON FILM-FORMING COMPOSITION, LITHOGRAPHIC UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CIRCUIT PATTERN 三菱瓦斯化学株式会社 2023-03-09 WO disclosed
WO-2022267730-A1 METHOD FOR SYNTHESIZING MOLECULAR GLASS, AND USE THEREOF AS HIGH-FREQUENCY LOW-DIELECTRIC-CONSTANT MATERIAL 中国科学院上海有机化学研究所 2022-12-29 WO disclosed
US-7157052-B1 Linear chemoselective carbosilane polymers and methods for use in analytical and purification applications THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 2007-01-02 US disclosed
US-6991887-B1 Photopatternable sorbent and functionalized films BATTELLE MEMORIAL INSTITUTE (US) 2006-01-31 US disclosed
US-6602551-B2 Addition-condensation copolymer GENERAL ELECTRIC COMPANY 2003-08-05 US disclosed
US-20030049465-A1 Curable silicone adhesive compositions GENERAL ELECTRIC COMPANY 2003-03-13 US disclosed
US-6015869-A SORBENT COPOLYMERS(OR OLIGOMERS) CONTAINING ALKYL-SUBSTITUTED FLUORINATED BISPHENOL MONOMERS ALTERNATING WITH SILOXANE MONOMERS, FOR SENSITIVE THIN FILMS ON SENSORS OR CLADDING ON OPTICAL FIBERS BATTELLE MEMORIAL INSTITUTE (US) 2000-01-18 US disclosed
EP-0372775-B1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS (JP) 1994-05-18 EP disclosed
US-4968762-A IMPACT STRENGTH, TOUGHNESS, LOW WATER ABSORPTION MITSUI TOATSU CHEMICALS, INC. (JP) 1990-11-06 US disclosed
EP-0372775-A1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-13 EP disclosed