Ethylene Glycol

Ethylene Glycol

SCHEMBL10604368

CC(CN=C=O)N=C=O.OCCO

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene Glycol SCHEMBL3267802 1.00
SCHEMBL44073 0.91
Ether SCHEMBL10884068 0.89 ALDH1A1 (0.30)
Hydrazine SCHEMBL22444473 0.86
SCHEMBL3049897 0.84
Toluene SCHEMBL3468312 0.83 KDM4E (0.33)
Diphenylmethane SCHEMBL3468648 0.82 LMNA (0.36)
SCHEMBL5668483 0.81
SCHEMBL6535623 0.81
SCHEMBL17743473 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115926172-B High-toughness high-hardness photo-curing resin based on trapezoid polysilsesquioxane and preparation method thereof 广州一新科技有限公司 2023-10-13 CN claimed
CN-115926172-A High-toughness high-hardness light-cured resin based on trapezoidal polysilsesquioxane and preparation method thereof 广州一新科技有限公司 2023-04-07 CN claimed
WO-2024128306-A1 COMPOSITE POLYMER MATERIAL, METHOD FOR PRODUCING SAME, AND OPTICAL MATERIAL 国立大学法人大阪大学 2024-06-20 WO disclosed
EP-4375312-A1 SILICONE-BASED POLYMER COMPOUND AND SILICONE-BASED POLYMER MATERIAL OSAKA UNIVERSITY (JP) 2024-05-29 EP disclosed
CN-117693545-A Organosilicon polymer compound and organosilicon polymer material 国立大学法人大阪大学 2024-03-12 CN disclosed
CN-115926172-B High-toughness high-hardness photo-curing resin based on trapezoid polysilsesquioxane and preparation method thereof 广州一新科技有限公司 2023-10-13 CN disclosed
US-20230192931-A1 HOST-GROUP-CONTAINING POLYMERIZABLE MONOMER, POLYMER MATERIAL, METHOD FOR PRODUCING SAME, AND CLATHRATE COMPOUND AND METHOD FOR PRODUCING SAME OSAKA UNIVERSITY (JP) 2023-06-22 US disclosed
CN-115926172-A High-toughness high-hardness light-cured resin based on trapezoidal polysilsesquioxane and preparation method thereof 广州一新科技有限公司 2023-04-07 CN disclosed
CN-111801355-B Polymer material and method for producing same 国立大学法人大阪大学 2023-02-28 CN disclosed
WO-2023003043-A1 SILICONE-BASED POLYMER COMPOUND AND SILICONE-BASED POLYMER MATERIAL 国立大学法人大阪大学 2023-01-26 WO disclosed
CN-110922518-B Water-resistant intumescent flame retardant and preparation method and application thereof 华东理工大学 2021-04-23 CN disclosed
CN-110922518-A Water-resistant intumescent flame retardant and preparation method and application thereof 华东理工大学 2020-03-27 CN disclosed
EP-3555203-A1 DISULFIDE-CONTAINING SELF-HEALING POLYMER BLEND Repsol, S.A. (ES) 2019-10-23 EP disclosed
CN-108348885-A The microcapsules and composition of the controlled release of active matter are provided 诺赛尔股份有限公司 2018-07-31 CN disclosed
WO-2018108950-A1 DISULFIDE-CONTAINING SELF-HEALING POLYMER BLEND REPSOL, S.A. (ES) 2018-06-21 WO disclosed
CN-107338661-A Thermal sublimation printing ink for transfer printing 纳米及先进材料研发院有限公司 2017-11-10 CN disclosed
CN-102690419-B Silicon-containing prepolymer and silicone hydrogel biomaterial containing same ZHAN QIANQING 2014-05-07 CN disclosed
EP-0143552-B1 COMPOSITE MEMBRANE AND PROCESS FOR THE PRODUCTION THEREOF NITTO DENKO CORPORATION (JP) 1989-09-06 EP disclosed
US-4618534-A ANISOTROPIC POLYIMIDE RESIN COATED WITH THIN LAYER OF CROSSLINKED POLYSILOXANE NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1986-10-21 US disclosed
EP-0143552-A2 Composite membrane and process for the production thereof NITTO DENKO CORPORATION (JP) 1985-06-05 EP disclosed